SNLS334G April   2011  – January 2015 DS80PCI800

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Ratings
    4. 6.4 Electrical Characteristics
    5. 6.5 Electrical Characteristics — Serial Management Bus Interface
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 4-Level Input Configuration Guidelines
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Control Mode
      2. 8.4.2 SMBUS Mode
    5. 8.5 Programming
      1. 8.5.1 System Management Bus (SMBus) and Configuration Registers
      2. 8.5.2 Transfer of Data Through the SMBus
      3. 8.5.3 Writing a Register
      4. 8.5.4 Reading a Register
      5. 8.5.5 SMBus Master Mode
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 DS80PCI800 versus DS80PCI810
      2. 9.1.2 Signal Integrity in PCIe Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V or 2.5-V Supply Mode Operation
    2. 10.2 Power Supply Bypassing
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout Considerations for Differential Pairs
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)(2)(3)

MIN MAX UNIT
Supply voltage (VDD - 2.5-V mode) –0.5 2.75 V
Supply voltage (VIN - 3.3-V mode) –0.5 4.0 V
LVCMOS input/output voltage –0.5 4.0 V
CML input voltage –0.5 VDD + 0.5 V
CML input current –30 30 mA
Junction temperature 125 °C
Lead temperature soldering (4 s)(4) 260 °C
Storage temperature, Tstg –40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Ratings. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Maximum Numbers are specified for a junction temperature range of –40°C to 125°C. Models are validated to Maximum Operating Voltages only.
(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(4) For soldering specifications: See application note SNOA549.

6.2 ESD Ratings

MAX UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±3000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
Machine model (MM), per JEDEC specification JESD22-A115-A ±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Ratings

MIN NOM MAX UNIT
Supply voltage (2.5-V mode) 2.375 2.5 2.625 V
Supply voltage (3.3-V mode) 3.0 3.3 3.6 V
Ambient temperature –40 25 85 °C
SMBus (SDA, SCL) 3.6 V
Supply noise up to 50 MHz(1) 100 mVp-p
(1) Allowed supply noise (mVp-p sine wave) under typical conditions.

6.4 Electrical Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER
PD Power Dissipation VDD = 2.5 V supply,
EQ Enabled,
VOD = 1.0 Vp-p,
RXDET = 1, PRSNT = 0		 500 700 mW
VIN = 3.3 V supply,
EQ Enabled,
VOD = 1.0 Vp-p,
RXDET = 1, PRSNT = 0		 660 900 mW
LVCMOS / LVTTL DC SPECIFICATIONS
VIH25 High-level input voltage
(PRSNT, READ_EN pins)		 2.5-V Mode 2.0 VDD V
VIH33 High-level input voltage
(PRSNT, READ_EN pins)		 3.3-V Mode 2.0 VIN V
VIL Low-Level Input Voltage
(PRSNT, READ_EN pins)		 0 0.8 V
VOH High-level output voltage
(ALL_DONE pin)		 IOH = −4 mA 2.0 V
VOL Low-level output voltage
(ALL_DONE pin)		 IOL = 4 mA 0.4 V
IIH Input high current (PRSNT pin) VIN = 3.6 V,
LVCMOS = 3.6 V		 –15 15 μA
Input high current with internal resistors (4–level input pin) 20 150 μA
IIL Input low current (PRSNT pin) VIN = 3.6 V,
LVCMOS = 0 V		 –15 15 μA
Input low current with internal resistors (4-level input pin) –160 –40 μA
CML RECEIVER INPUTS (IN_n+, IN_n-)
RLRX-DIFF RX differential return loss 0.05 to 1.25 GHz –16 dB
1.25 to 2.5 GHz –16 dB
2.5 to 4.0 GHz –14 dB
RLRX-CM RX common mode return loss 0.05 to 2.5 GHz –12 dB
2.5 to 4.0 GHz –8 dB
ZRX-DC RX DC single-ended impedance Tested at VDD = 2.5 V 40 50 60 Ω
ZRX-DIFF-DC RX DC differential mode impedance Tested at VDD = 2.5 V 80 100 120 Ω
ZRX-HIGH-IMP-DC-POS DC input common mode impedance for V > 0 VID = 0 to 200 mV,
ENSMB = 0, RXDET = 0,
VDD = 2.5 V		 50 kΩ
VRX-DIFF-DC Differential RX peak-to-peak voltage (VID) Tested at pins 1.2 V
VRX-SIGNAL-DET-DIFF-PP Signal detect assert level for active data signal SD_TH = float,
0101 pattern at 8 Gbps
Measured at pins		 180 mVp-p
VRX-IDLE-DET-DIFF-PP Signal detect deassert level for electrical idle SD_TH = float,
0101 pattern at 8 Gbps
Measured at pins		 110 mVp-p
HIGH-SPEED OUTPUTS
VTX-DIFF-PP Output voltage differential swing Differential measurement with OUT_n+ and OUT_n-,
terminated by 50 Ω to GND,
AC-Coupled, VID = 1.0 Vp-p,
DEM0 = 1, DEM1 = 0(1)		 0.8 1.0 1.2 Vp-p
VTX-DE-RATIO_3.5 TX de-emphasis ratio VOD = 1.0 Vp-p,
DEM0 = 0, DEM1 = R
Gen 1 & 2 modes only		 –3.5 dB
VTX-DE-RATIO_6 TX de-emphasis ratio VOD = 1.0 Vp-p,
DEM0 = R, DEM1 = R
Gen 1 & 2 modes only		 –6 dB
tTX-DJ Deterministic Jitter VID = 800 mV, PRBS15 pattern, 8.0 Gbps, VOD = 1.0 V,
EQ = 0x00, DE = 0 dB (no input or output trace loss)		 0.05 UIpp
tTX-RJ Random Jitter VID = 800 mV, 0101 pattern, 8.0 Gbps, VOD = 1.0 V,
EQ = 0x00, DE = 0 dB, (no input or output trace loss)		 0.3 ps RMS
tTX-RISE-FALL TX rise/fall time 20% to 80% of differential output voltage(3) 35 45 ps
tRF-MISMATCH TX rise/fall mismatch 20% to 80% of differential output voltage(3) 0.01 0.1 UI
RLTX-DIFF TX differential return loss 0.05 to 1.25 GHz –16 dB
1.25 to 2.5 GHz –12 dB
2.5 to 4 GHz –11 dB
RLTX-CM TX common mode return loss 0.05 to 2.5 GHz –12 dB
2.5 to 4 GHz –8 dB
ZTX-DIFF-DC DC differential TX impedance 100 Ω
VTX-CM-AC-PP TX AC peak-peak common mode voltage VOD = 1.0 Vp-p,
DEM0 = 1, DEM1 = 0(3)		 100 mVp-p
ITX-SHORT TX short circuit current limit Total current the transmitter can supply when shorted to VDD or GND 20 mA
VTX-CM-DC-ACTIVE-IDLE-DELTA Absolute delta of DC common mode voltage during L0 and electrical idle (3) 100 mV
VTX-CM-DC-LINE-DELTA Absolute delta of DC common mode voltgae between TX+ and TX- (3) 25 mV
tTX-IDLE-DATA Max time to transition to differential DATA signal after IDLE VID = 1.0 Vp-p, 8 Gbps 3.5 ns
tTX-DATA-IDLE Max time to transition to IDLE after differential DATA signal VID = 1.0 Vp-p, 8 Gbps 6.2 ns
tPLHD/PHLD High-to-low and low-to-high differential propagation delay EQ = 0x00(2) 200 ps
tLSK Lane-to-lane skew T = 25°C, VDD = 2.5 V 25 ps
tPPSK Part-to-part propagation delay skew T = 25°C, VDD = 2.5 V 40 ps
EQUALIZATION
DJE1 Residual deterministic jitter at
8 Gbps		 35” 4mils FR4,
VID = 0.8 Vp-p,
PRBS15, EQ = 0x1F,
DEM = 0 dB		 0.14 UIpp
DJE2 Residual deterministic jitter at
5 Gbps		 35” 4mils FR4,
VID = 0.8 Vp-p,
PRBS15, EQ = 0x1F,
DEM = 0 dB		 0.1 UIpp
DJE3 Residual deterministic jitter at 2.5 Gbps 35” 4mils FR4,
VID = 0.8 Vp-p,
PRBS15, EQ = 0x1F,
DEM = 0 dB		 0.05 UIpp
DJE4 Residual deterministic jitter at
8 Gbps		 10 meters 30-awg cable,
VID = 0.8 Vp-p,
PRBS15, EQ = 0x2F,
DEM = 0 dB		 0.16 UIpp
DJE5 Residual deterministic jitter at
5 Gbps		 10 meters 30-awg cable,
VID = 0.8 Vp-p,
PRBS15, EQ = 0x2F,
DEM = 0 dB		 0.1 UIpp
DJE6 Residual deterministic jitter at 2.5 Gbps 10 meters 30-awg cable,
VID = 0.8 Vp-p,
PRBS15, EQ = 0x2F,
DEM = 0 dB		 0.05 UIpp
DE-EMPHASIS (GEN 1,2 MODE ONLY)
DJD1 Residual deterministic jitter at 2.5 Gbps and 5.0 Gbps 10” 4mils FR4,
VID = 0.8 Vp-p,
PRBS15, EQ = 0x00,
VOD = 1.0 Vp-p,
DEM = −3.5 dB		 0.1 UIpp
DJD2 Residual deterministic jitter at 2.5 Gbps and 5.0 Gbps 20” 4mils FR4,
VID = 0.8 Vp-p,
PRBS15, EQ = 0x00,
VOD = 1.0 Vp-p,
DEM = –9 dB		 0.1 UIpp
(1) In GEN3 mode, the output VOD level is not fixed. It will be adjusted automatically based on the VID input amplitude level. The output VOD level set by DEMA/B[1:0] in GEN3 mode is dependent on the VID level and the frequency content. The DS80PCI800 repeater in GEN3 mode is designed to be transparent, so the TX-FIR (de-emphasis) is passed to the RX to support the PCIe GEN3 handshake negotiation link training.
(2) Propagation delay measurements will change slightly based on the level of EQ selected. EQ = 0x00 will result in the largest propagation delays.
(3) Parameter is characterized but not tested in production.

6.5 Electrical Characteristics — Serial Management Bus Interface

Over recommended operating supply and temperature ranges unless other specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SERIAL BUS INTERFACE DC SPECIFICATIONS
VIL Data, clock input low voltage 0.8 V
VIH Data, clock input high voltage 2.1 3.6 V
IPULLUP Current through pullup resistor or current source High Power Specification 4 mA
VDD Nominal bus voltage 2.375 3.6 V
ILEAK-Bus Input leakage per bus segment (1)  –200 200 µA
ILEAK-Pin Input leakage per device pin –15 µA
CI Capacitance for SDA and SCL (1)(2) 10 pF
RTERM External termination resistance pull to VDD = 2.5 V ± 5% or 3.3 V ± 10% Pullup VDD = 3.3 V(1)(2)(3) 2000 Ω
Pullup VDD = 2.5 V(1)(2)(3) 1000 Ω
SERIAL BUS INTERFACE TIMING SPECIFICATIONS
FSMB Bus operating frequency ENSMB = VDD (Slave Mode) 400 kHz
ENSMB = FLOAT (Master Mode) 280 400 520 kHz
tBUF Bus free time between stop and start condition 1.3 µs
tHD:STA Hold time after (repeated) start condition. After this period, the first clock is generated. At IPULLUP, Max 0.6 µs
tSU:STA Repeated start condition setup time 0.6 µs
tSU:STO Stop condition setup time 0.6 µs
tHD:DAT Data hold time 0 ns
tSU:DAT Data setup time 100 ns
tLOW Clock low period 1.3 µs
tHIGH Clock high period (4)  0.6 50 µs
tF Clock/data fall time (4)  300 ns
tR Clock/data rise time (4)  300 ns
tPOR Time in which a device must be operational after power-on reset (4)(5) 500 ms
(1) Recommended value.
(2) Recommended maximum capacitance load per bus segment is 400 pF.
(3) Maximum termination voltage should be identical to the device supply voltage.
(4) Compliant to SMBus 2.0 physical layer specification. See System Management Bus (SMBus) Specification Version 2.0, section 3.1.1 SMBus common AC specifications for details.
(5) Specified by design. Parameter not tested in production.

6.6 Typical Characteristics

30133327.gif
Figure 1. Power Dissipation (PD) vs Output Differential Voltage (VOD)
30133329.gif
Figure 3. Output Differential Voltage (VOD = 1.0 Vp-p) vs Temperature
30133328.gif
Figure 2. Output Differential Voltage (VOD = 1.0 Vp-p) vs Supply Voltage (VDD)