SNLS493A October   2014  – January 2015 DS80PCI810

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Handling Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Electrical Characteristics — Serial Management Bus Interface
    8. 6.8 Timing Requirements Serial Bus Interface
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 19
      2. 7.2.2 Functional Datapath Blocks
    3. 7.3 Feature Description
      1. 7.3.1 Typical 4-Level Input Thresholds
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Control Mode:
      2. 7.4.2 Slave SMBus Mode:
      3. 7.4.3 SMBus Master Mode
      4. 7.4.4 Signal Conditioning Settings
    5. 7.5 Programming
      1. 7.5.1 EEPROM Address Map for Single Device
      2. 7.5.2 SMBus
      3. 7.5.3 Transfer Of Data Via The SMBus
      4. 7.5.4 SMBus Transactions
    6. 7.6 Writing a Register
    7. 7.7 Reading a Register
    8. 7.8 Register Maps
  8. 8 Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 DS80PCI810 versus DS80PCI800
      2. 8.1.2 Signal Integrity in PCIe Applications
      3. 8.1.3 Rx Detect Functionality in PCIe Applications
    2. 8.2 Typical Applications
      1. 8.2.1 Generic High Speed Repeater
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
          1. 8.2.1.3.1 Pre-Channel Only Setup
          2. 8.2.1.3.2 Pre-Channel and Post-Channel Setup
      2. 8.2.2 PCIe Board Applications (PCIe Gen-3)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Design Procedure
        3. 8.2.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Trademarks

All other trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.