SNLS055J November   1999  – May 2016 DS90CF366 , DS90CF386

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 LVDS Receivers
        1. 7.3.1.1 LVDS Input Termination
      2. 7.3.2 Phase Locked Loop (PLL)
      3. 7.3.3 Serial LVDS-to-Parallel LVCMOS Converter
      4. 7.3.4 LVCMOS Drivers
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Sequencing and Power-Down Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Cables
        2. 8.2.2.2 Bit Resolution and Operating Frequency Compatibility
        3. 8.2.2.3 Data Mapping between Receiver and Endpoint Panel Display
        4. 8.2.2.4 RSKM Interoperability
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

Proper power supply decoupling is important to ensure a stable power supply with minimal power supply noise. Bypassing capacitors are needed to reduce the impact of switching noise which could limit performance. For a conservative approach, three parallel-connected decoupling capacitors (multi-layered ceramic type in surface mount form factor) between each VCC (VCC, PLL VCC, LVDS VCC) and the ground plane(s) are recommended. The three capacitor values are 0.1 μF, 0.01 μF, and 0.001 μF. The preferred capacitor size is 0402. An example is shown in Figure 28. The designer should employ wide traces for power and ground and ensure each capacitor has its own via to the ground plane. This helps to reduce overall inductance with regards to power supply filtering. If board space is limiting the number of bypass capacitors, the PLL VCC should receive the most filtering. Next would be the LVDS VCC pins and finally the logic VCC pins.

DS90CF366 DS90CF386 01291025.gif Figure 28. Recommended Bypass Capacitor Decoupling
Configuration for VCC, PLL VCC, and LVDS VCC