SNLS055J November   1999  – May 2016 DS90CF366 , DS90CF386

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 LVDS Receivers
        1. 7.3.1.1 LVDS Input Termination
      2. 7.3.2 Phase Locked Loop (PLL)
      3. 7.3.3 Serial LVDS-to-Parallel LVCMOS Converter
      4. 7.3.4 LVCMOS Drivers
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Sequencing and Power-Down Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Cables
        2. 8.2.2.2 Bit Resolution and Operating Frequency Compatibility
        3. 8.2.2.3 Data Mapping between Receiver and Endpoint Panel Display
        4. 8.2.2.4 RSKM Interoperability
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from I Revision (April 2013) to J Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed Figure 8 and Figure 9 to clarify that TxIN on Tx is the same as RxOUT on Rx Go
  • Changed title of DS90CF366 mapping to clarify the make-up of the LVDS linesGo
  • Deleted references to power sequencing requirements for FPD-Link I transmitters Go

Changes from H Revision (April 2013) to I Revision

  • Changed layout of National Data Sheet to TI formatGo