SNLS199B September   2005  – January 2019 DS90LT012AH

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Connection Diagram
      2.      Functional Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Termination
      2. 8.3.2 Threshold
      3. 8.3.3 Fail-Safe Feature
      4. 8.3.4 Probing LVDS Transmission Lines
      5. 8.3.5 Cables and Connectors, General Comments
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Point-to-Point Communications
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Receiver Bypass Capacitance
          2. 9.2.1.2.2 Interconnecting Media
          3. 9.2.1.2.3 PCB Transmission Lines
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip vs. Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Switching Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified. (1)(2)
PARAMETER MIN TYP MAX UNIT
tPHLD Differential Propagation Delay High to Low CL = 15 pF
VID = 200 mV
(Figure 9 and Figure 10) 		1 1.8 3.5 ns
tPLHD Differential Propagation Delay Low to High 1 1.7 3.5 ns
tSKD1 Differential Pulse Skew |tPHLD − tPLHD| (3) 0 100 400 ps
tSKD3 Differential Part to Part Skew (4) 0 0.3 1.0 ns
tSKD4 Differential Part to Part Skew (5) 0 0.4 1.5 ns
tTLH Rise Time 350 800 ps
tTHL Fall Time 175 800 ps
fMAX Maximum Operating Frequency (6) 200 250 MHz
(1) CL includes probe and jig capacitance.
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50 Ω, tr and tf (0% to 100%) ≤ 3 ns for IN±.
(3) tSKD1 is the magnitude difference in differential propagation delay time between the positive-going-edge and the negative-going-edge of the same channel.
(4) tSKD3, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices at the same VDD and within 5°C of each other within the operating temperature range.
(5) tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices over the recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min| differential propagation delay.
(6) fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, differential (1.05 V to 1.35 peak to peak). Output criteria: 60%/40% duty cycle, VOL (max 0.4 V), VOH (min 2.4 V), load = 15 pF (stray plus probes). The parameter is specified by design. The limit is based on the statistical analysis of the device over the PVT range by the transition times (tTLH and tTHL).