SNLS201B September   2005  – January 2019 DS90LV028AH

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Connection Diagram
      2.      Functional Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Termination
      2. 8.3.2 Threshold
      3. 8.3.3 Fail-Safe Feature
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Receiver Bypass Capacitance
        2. 9.2.2.2 Interconnecting Media
        3. 9.2.2.3 PCB Transmission Lines
        4. 9.2.2.4 Input Fail-Safe Biasing
        5. 9.2.2.5 Probing LVDS Transmission Lines on PCB
        6. 9.2.2.6 Cables and Connectors, General Comments
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Microstrip vs. Stripline Topologies
      2. 11.1.2 Dielectric Type and Board Construction
      3. 11.1.3 Recommended Stack Layout
      4. 11.1.4 Separation Between Traces
      5. 11.1.5 Crosstalk and Ground Bounce Minimization
      6. 11.1.6 Decoupling
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.(1)(2)
PARAMETER TEST CONDITIONS PIN MIN TYP MAX UNIT
VTH Differential Input High Threshold VCM = +1.2 V, 0 V, 3 V(4) RIN+, RIN− +100 mV
VTL Differential Input Low Threshold −100 mV
IIN Input Current VIN = +2.8 V VCC = 3.6 V or 0 V −10 ±1 +10 μA
VIN = 0 V −10 ±1 +10 μA
VIN = +3.6 V VCC = 0 V –20 +20 μA
VOH Output High Voltage IOH = −0.4 mA, VID = +200 mV ROUT 2.7 3.1 V
IOH = −0.4 mA, Inputs terminated 2.7 3.1 V
IOH = −0.4 mA, Inputs shorted 2.7 3.1 V
VOL Output Low Voltage IOL = 2 mA, VID = −200 mV 0.3 0.5 V
IOS Output Short Circuit Current VOUT = 0 V(3) −15 −50 −100 mA
VCL Input Clamp Voltage ICL = −18 mA −1.5 −0.8 V
ICC No Load Supply Current Inputs Open VCC 5.4 9 mA
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground unless otherwise specified (such as VID).
(2) All typicals are given for: VCC = +3.3 V and TA = +25°C.
(3) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted at a time, do not exceed maximum junction temperature specification.
(4) VCC is always higher than RIN+ and RIN− voltage. RIN+ and RIN− are allowed to have voltage range –0.05 V to +3.05 V. VID is not allowed to be greater than 100 mV when VCM = 0 V or 3 V.