SNLS299I May   2008  – June 2020 DS90LV028AQ-Q1

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Performance Curves
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Design Procedure
        1. 9.2.1.1 Power Decoupling Recommendations
        2. 9.2.1.2 Termination
        3. 9.2.1.3 Input Failsafe Biasing
        4. 9.2.1.4 Probing LVDS Transmission Lines
        5. 9.2.1.5 Cables and Connectors, General Comments
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Differential Traces
      2. 10.1.2 PC Board Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.1.1 Power Decoupling Recommendations

Bypass capacitors must be used on power pins. Use high frequency ceramic (surface mount is recommended) 0.1 μF and 0.01 μF capacitors in parallel at the power supply pin with the smallest value capacitor closest to the device supply pin. Additional scattered capacitors over the printed circuit board will improve decoupling. Multiple vias should be used to connect the decoupling capacitors to the power planes. A 10 μF (35 V) or greater solid tantalum capacitor should be connected at the power entry point on the printed circuit board between the supply and ground.