SNLS708 February 2023 DS90UB638-Q1
PRODUCTION DATA
THERMAL METRIC(1) | DS90UB638-Q1 | UNIT | |
---|---|---|---|
RGC (VQFN) | |||
48 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 30.2 | °C/W |
RθJC(TOP) | Junction-to-case (top) thermal resistance | 15.7 | °C/W |
RθJC(BOT) | Junction-to-case (bottom) thermal resistance | 1.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 6.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 6.7 | °C/W |