SNLS499D April   2016  – October 2019 DS90UB914A-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions: DS90UB914A-Q1 Deserializer
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 AC Timing Specifications (SCL, SDA) - I2C-Compatible
    7. 7.7 Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C-Compatible
    8. 7.8 Deserializer Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Timing Diagrams and Test Circuits
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Serial Frame Format
      2. 9.3.2  Line Rate Calculations for the DS90UB913A/914A
      3. 9.3.3  Deserializer Multiplexer Input
      4. 9.3.4  Error Detection
      5. 9.3.5  Synchronizing Multiple Cameras
      6. 9.3.6  General-Purpose I/O (GPIO) Descriptions
      7. 9.3.7  LVCMOS VDDIO Option
      8. 9.3.8  EMI Reduction
        1. 9.3.8.1 Deserializer Staggered Output
        2. 9.3.8.2 Spread Spectrum Clock Generation (SSCG) on the Deserializer
      9. 9.3.9  Pixel Clock Edge Select (TRFB / RRFB)
      10. 9.3.10 Power Down
    4. 9.4 Device Functional Modes
      1. 9.4.1 DS90UB913A/914A Operation With External Oscillator as Reference Clock
      2. 9.4.2 DS90UB913A/914A Operation With Pixel Clock From Imager as Reference Clock
      3. 9.4.3 MODE Pin on Deserializer
      4. 9.4.4 Clock-Data Recovery Status Flag (LOCK), Output Enable (OEN) and Output State Select (OSS_SEL)
      5. 9.4.5 Built-In Self Test
      6. 9.4.6 BIST Configuration and Status
      7. 9.4.7 Sample BIST Sequence
    5. 9.5 Programming
      1. 9.5.1 Programmable Controller
      2. 9.5.2 Description of Bidirectional Control Bus and I2C Modes
      3. 9.5.3 I2C Pass-Through
      4. 9.5.4 Slave Clock Stretching
      5. 9.5.5 ID[x] Address Decoder on the Deserializer
      6. 9.5.6 Multiple Device Addressing
    6. 9.6 Register Maps
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Power Over Coax
      2. 10.1.2 Power-Up Requirements and PDB Pin
      3. 10.1.3 AC Coupling
      4. 10.1.4 Transmission Media
      5. 10.1.5 Adaptive Equalizer – Loss Compensation
    2. 10.2 Typical Applications
      1. 10.2.1 Coax Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 STP Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Interconnect Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.2 Layout Example

Stencil parameters such as aperture area ratio and the fabrication process have a significant impact on paste deposition. Inspection of the stencil prior to placement of the WQFN package is highly recommended to improve board assembly yields. If the via and aperture openings are not carefully monitored, the solder may flow unevenly through the DAP. Stencil parameters for aperture opening and via locations are shown below:

DS90UB914A-Q1 LLP_stencil_nopullback_explanation_diagram_snls302.pngFigure 41. No Pullback WQFN, Single Row Reference Diagram

Table 13. No Pullback WQFN Stencil Aperture Summary for DS90UB914A-Q1

DEVICE PIN COUNT MKT DWG PCB I/O PAD SIZE (mm) PCB PITCH (mm) PCB DAP SIZE(mm) STENCIL I/O APERTURE (mm) STENCIL DAP APERTURE (mm) NUMBER OF DAP APERTURE OPENINGS GAP BETWEEN DAP APERTURE (Dim A mm)
DS90UB914A-Q1 48 RHS 0.25 x 0.6 0.5 5.1 x 5.1 0.25 x 0.7 1.1 x 1.1 16 0.2
DS90UB914A-Q1 sample_layout_DAP_snls302.pngFigure 42. 48-Pin WQFN Stencil Example of Via and Opening Placement
DS90UB914A-Q1 layout_example_914a_snls499.gifFigure 43. DS90UB914A-Q1 Deserializer Example Layout

The following PCB layout examples are derived from the layout design of the DS90UB914A-Q1 Evaluation Module (see DS90UB913A-CXEVM and DS90UB914A-CXEVM User’s Guide (SNLU135)). These graphics and additional layout description are used to demonstrate both proper routing and proper solder techniques when designing in this Deserializer.