SNLS457B November   2014  – August 2019 DS90UB929-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC And AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing for the Serial Control Bus
    9. 6.9  Timing Diagrams
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Definition Multimedia Interface (HDMI)
        1. 7.3.1.1 HDMI Receive Controller
      2. 7.3.2  Transition Minimized Differential Signaling
      3. 7.3.3  Enhanced Display Data Channel
      4. 7.3.4  Extended Display Identification Data (EDID)
        1. 7.3.4.1 External Local EDID (EEPROM)
        2. 7.3.4.2 Internal EDID (SRAM)
        3. 7.3.4.3 External Remote EDID
        4. 7.3.4.4 Internal Pre-Programmed EDID
      5. 7.3.5  Consumer Electronics Control (CEC)
      6. 7.3.6  +5-V Power Signal
      7. 7.3.7  Hot Plug Detect (HPD)
      8. 7.3.8  High-Speed Forward Channel Data Transfer
      9. 7.3.9  Back Channel Data Transfer
      10. 7.3.10 Power Down (PDB)
      11. 7.3.11 Serial Link Fault Detect
      12. 7.3.12 Interrupt Pin (INTB)
      13. 7.3.13 Remote Interrupt Pin (REM_INTB)
      14. 7.3.14 General-Purpose I/O
        1. 7.3.14.1 GPIO[3:0] Configuration
        2. 7.3.14.2 GPIO_REG[8:5] Configuration
      15. 7.3.15 Backward Compatibility
      16. 7.3.16 Audio Modes
        1. 7.3.16.1 HDMI Audio
        2. 7.3.16.2 DVI I2S Audio Interface
          1. 7.3.16.2.1 I2S Transport Modes
          2. 7.3.16.2.2 I2S Repeater
        3. 7.3.16.3 AUX Audio Channel
        4. 7.3.16.4 TDM Audio Interface
      17. 7.3.17 Built-In Self Test (BIST)
        1. 7.3.17.1 BIST Configuration And Status
        2. 7.3.17.2 Forward Channel and Back Channel Error Checking
      18. 7.3.18 Internal Pattern Generation
        1. 7.3.18.1 Pattern Options
        2. 7.3.18.2 Color Modes
        3. 7.3.18.3 Video Timing Modes
        4. 7.3.18.4 External Timing
        5. 7.3.18.5 Pattern Inversion
        6. 7.3.18.6 Auto Scrolling
        7. 7.3.18.7 Additional Features
      19. 7.3.19 Spread Spectrum Clock Tolerance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Select Configuration Settings (MODE_SEL[1:0])
      2. 7.4.2 FPD-Link III Single Link Operation
      3. 7.4.3 Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
      2. 7.5.2 Multi-Master Arbitration Support
      3. 7.5.3 I2C Restrictions on Multi-Master Operation
      4. 7.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 7.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 7.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Applications Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High-Speed Interconnect Guidelines
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Application Performance Plots
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Design Requirements

The SER/DES supports only AC-coupled interconnects through an integrated DC-balanced decoding scheme. External AC-coupling capacitors must be placed in series in the FPD-Link III signal path as shown in Figure 24.

Table 11. Design Parameters

DESIGN PARAMETER EXAMPLE VALUE
VDDIO 1.8 V
AC-Coupling Capacitor for DOUT0± and DOUT1± with 92x deserializers 100 nF
AC-Coupling Capacitor for DOUT0± and DOUT1± with 94x deserializers 33 nF

For applications using single-ended 50-Ω coaxial cable, the unused data pins (DOUT-) should use a 15-nF capacitor and should be terminated with a 50-Ω resistor.

DS90UB929-Q1 STP_AC_COUPLE.gifFigure 24. AC-Coupled Connection (STP)
DS90UB929-Q1 COAX_AC_COUPLE.gifFigure 25. AC-Coupled Connection (Coaxial)

For high-speed FPD–Link III transmissions, the smallest available package should be used for the AC-coupling capacitor. This will help minimize degradation of signal quality due to package parasitics.