SNLS457B November   2014  – August 2019 DS90UB929-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC And AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing for the Serial Control Bus
    9. 6.9  Timing Diagrams
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Definition Multimedia Interface (HDMI)
        1. 7.3.1.1 HDMI Receive Controller
      2. 7.3.2  Transition Minimized Differential Signaling
      3. 7.3.3  Enhanced Display Data Channel
      4. 7.3.4  Extended Display Identification Data (EDID)
        1. 7.3.4.1 External Local EDID (EEPROM)
        2. 7.3.4.2 Internal EDID (SRAM)
        3. 7.3.4.3 External Remote EDID
        4. 7.3.4.4 Internal Pre-Programmed EDID
      5. 7.3.5  Consumer Electronics Control (CEC)
      6. 7.3.6  +5-V Power Signal
      7. 7.3.7  Hot Plug Detect (HPD)
      8. 7.3.8  High-Speed Forward Channel Data Transfer
      9. 7.3.9  Back Channel Data Transfer
      10. 7.3.10 Power Down (PDB)
      11. 7.3.11 Serial Link Fault Detect
      12. 7.3.12 Interrupt Pin (INTB)
      13. 7.3.13 Remote Interrupt Pin (REM_INTB)
      14. 7.3.14 General-Purpose I/O
        1. 7.3.14.1 GPIO[3:0] Configuration
        2. 7.3.14.2 GPIO_REG[8:5] Configuration
      15. 7.3.15 Backward Compatibility
      16. 7.3.16 Audio Modes
        1. 7.3.16.1 HDMI Audio
        2. 7.3.16.2 DVI I2S Audio Interface
          1. 7.3.16.2.1 I2S Transport Modes
          2. 7.3.16.2.2 I2S Repeater
        3. 7.3.16.3 AUX Audio Channel
        4. 7.3.16.4 TDM Audio Interface
      17. 7.3.17 Built-In Self Test (BIST)
        1. 7.3.17.1 BIST Configuration And Status
        2. 7.3.17.2 Forward Channel and Back Channel Error Checking
      18. 7.3.18 Internal Pattern Generation
        1. 7.3.18.1 Pattern Options
        2. 7.3.18.2 Color Modes
        3. 7.3.18.3 Video Timing Modes
        4. 7.3.18.4 External Timing
        5. 7.3.18.5 Pattern Inversion
        6. 7.3.18.6 Auto Scrolling
        7. 7.3.18.7 Additional Features
      19. 7.3.19 Spread Spectrum Clock Tolerance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Select Configuration Settings (MODE_SEL[1:0])
      2. 7.4.2 FPD-Link III Single Link Operation
      3. 7.4.3 Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
      2. 7.5.2 Multi-Master Arbitration Support
      3. 7.5.3 I2C Restrictions on Multi-Master Operation
      4. 7.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 7.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 7.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Applications Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High-Speed Interconnect Guidelines
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Application Performance Plots
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (March 2019) to B Revision

  • Changed VDD11 maximum from 1.32 V back to 1.7 VGo
  • Added Receiving Notification of Documentation Updates section Go

Changes from * Revision (November 2014) to A Revision

  • Changed all references of HDMI Clock to TMDS Clock.Go
  • Changed the VTERM pin descriptionGo
  • Changed VDD11 maximum from: 1.7 V to: 1.32 VGo
  • Added RX_5V parameter to the Recommended Operating ConditionsGo
  • Added TCLH1/2 and TCHL1/2 parameters to the Recommended Operating ConditionsGo
  • Changed the TMDS jitter specification in the AC Electrical Characteristics tableGo
  • Added information about using I2S with the DS90UH926-Q1 in the Audio Modes sectionGo
  • Deleted Auto Soft Sleep mode from the MODE_SEL[1:0] Settings tableGo
  • Added Frequency Detection Circuit sectionGo
  • Added 5% resistor information to the Serial Control Bus sectionGo
  • Added information to Multi-Master Arbitration Support sectionGo
  • Added additional information to register 0x01Go
  • Added registers 0x00, 0x13, 0x15, 0x5B, 0xC0, 0xC2, 0xC3, 0xC6, 0xC8, 0xCE, and 0xD0 to default listGo
  • Changed information about GPIO0 modes x00 and x10Go
  • Changed information about GPIO1 modes x00 and x10Go
  • Added reset information to register 0x15Go
  • Changed the register 0x1A informationGo
  • Added Registers 0x40, 0x41, and 0x42Go
  • Deleted Rev A1 silicon informationGo
  • Added 'Set to 0' test to the 0x5B register descriptionGo
  • Changed register 0x5C[4:3] information. Go
  • Added Page 0x10 RegisterGo
  • Added Page 0x14 RegisterGo
  • Changed graph caption from: 1080p60 Video at 2.6 Gbps Serial Line Rate (One of Two Lanes) to: 720p60 Video at 2.6-Gbps Serial Line Rate, Single Lane FPD-Link III OutputGo
  • Changed Power-Up Requirements sectionGo