SNLS507C September   2016  – December 2022 DS90UB934-Q1

PRODUCTION DATA  

  1.   Features
  2. 1Applications
  3. 2Description
  4. 3Revision History
  5.   Pin Configuration and Functions
  6. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 DC Electrical Characteristics
    6. 4.6 AC Electrical Characteristics
    7. 4.7 Recommended Timing for the Serial Control Bus
    8. 4.8 Typical Characteristics
  7. 5Detailed Description
    1. 5.1 Overview
      1. 5.1.1 Functional Description
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1 Serial Frame Format
      2. 5.3.2 Line Rate Calculations for the DS90UB933/934
      3. 5.3.3 Deserializer Multiplexer Input
    4. 5.4 Device Functional Modes
      1. 5.4.1 RX MODE Pin
      2. 5.4.2 DVP Output Control
        1. 5.4.2.1 LOCK Status
      3. 5.4.3 Input Jitter Tolerance
      4. 5.4.4 Adaptive Equalizer
      5. 5.4.5 Channel Monitor Loop-Through Output Driver
        1. 5.4.5.1 Code Example for CMLOUT FPD3 RX Port 0:
      6. 5.4.6 GPIO Support
        1. 5.4.6.1 Back Channel GPIO
        2. 5.4.6.2 GPIO Pin Status
        3. 5.4.6.3 Other GPIO Pin Controls
        4. 5.4.6.4 FrameSync Operation
          1. 5.4.6.4.1 External FrameSync Control
          2. 5.4.6.4.2 Internally Generated FrameSync
            1. 5.4.6.4.2.1 Code Example for Internally Generated FrameSync
    5. 5.5 Programming
      1. 5.5.1 Serial Control Bus
        1. 5.5.1.1 I2C Target Operation
        2. 5.5.1.2 Remote Target Operation
        3. 5.5.1.3 Remote I2C Targets Data Throughput
        4. 5.5.1.4 Remote Target Addressing
        5. 5.5.1.5 Broadcast Write to Remote Target Devices
        6. 5.5.1.6 Code Example for Broadcast Write
      2. 5.5.2 Interrupt Support
        1. 5.5.2.1 Code Example to Enable Interrupts
        2. 5.5.2.2 FPD-Link III Receive Port Interrupts
        3. 5.5.2.3 Code Example to Readback Interrupts
        4. 5.5.2.4 Built-In Self Test (BIST)
          1. 5.5.2.4.1 BIST Configuration and Status
    6. 5.6 Register Maps
      1. 5.6.1 Register Description
      2. 5.6.2 Registers
      3. 5.6.3 Indirect Access Registers
      4. 5.6.4 Indirect Access Register Map
        1. 5.6.4.1 FPD3 Channel 0 Registers
        2. 5.6.4.2 FPD3 Channel 1 Registers
        3. 5.6.4.3 FPD3 RX Shared Registers
  8. 6Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Power Over Coax
    3. 6.3 Typical Application
      1. 6.3.1 Design Requirements
      2. 6.3.2 Detailed Design Procedure
      3. 6.3.3 Application Curves
    4. 6.4 System Examples
    5. 6.5 Power Supply Recommendations
      1. 6.5.1 VDD Power Supply
      2. 6.5.2 Power-Up Sequencing
      3. 6.5.3 PDB Pin
      4. 6.5.4 Ground
    6. 6.6 Layout
      1. 6.6.1 Layout Guidelines
        1. 6.6.1.1 DVP Interface Guidelines
      2. 6.6.2 Layout Example
  9.   Mechanical, Packaging, and Orderable Information
  10. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Glossary
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Support Resources
    5. 7.5 Trademarks
  11.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6.1.1 DVP Interface Guidelines

  1. Route ROUT[11:0] with controlled 50-Ω single-ended impedance (±15%).
  2. Keep away from other high speed signals.
  3. Keep lengths to within 5 mils of each other.
  4. Length matching must be near the location of mismatch.
  5. Separate each signal by at least by 3 times the signal trace width.
  6. Keep the use of bends in traces to a minimum. When bends are used, the number of left and right bends must be as equal as possible, and the angle of the bends must be ≥ 135 degrees. This arrangement minimizes any length mismatch caused by the bends, and therefore minimizes the impact that bends have on EMI.
  7. Route all signals on the same layer
  8. The number of vias should be kept to a minimum. TI recommends keeping the via count to 2 or fewer.
  9. Keep traces on layers adjacent to ground plane.
  10. Do NOT route signals over any GND plane split.
  11. Adding test points causes impedance discontinuity and therefore negatively impacts signal performance. If test points are used, place them in series and symmetrically. They must not be placed in a manner that causes a stub.