SNLS605C July   2018  – April 2024 DS90UB935-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Recommended Timing for the Serial Control Bus
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 CSI-2 Receiver
        1. 6.3.1.1 CSI-2 Receiver Operating Modes
        2. 6.3.1.2 CSI-2 Receiver High-Speed Mode
        3. 6.3.1.3 CSI-2 Protocol Layer
        4. 6.3.1.4 CSI-2 Short Packet
        5. 6.3.1.5 CSI-2 Long Packet
        6. 6.3.1.6 CSI-2 Errors and Detection
          1. 6.3.1.6.1 CSI-2 ECC Detection and Correction
          2. 6.3.1.6.2 CSI-2 Check Sum Detection
          3. 6.3.1.6.3 D-PHY Error Detection
          4. 6.3.1.6.4 CSI-2 Receiver Status
      2. 6.3.2 FPD-Link III Forward Channel Transmitter
        1. 6.3.2.1 Frame Format
      3. 6.3.3 FPD-Link III Back Channel Receiver
      4. 6.3.4 Serializer Status and Monitoring
        1. 6.3.4.1 Forward Channel Diagnostics
        2. 6.3.4.2 Back Channel Diagnostics
        3. 6.3.4.3 Voltage and Temperature Sensing
          1. 6.3.4.3.1 Programming Example
        4. 6.3.4.4 Built-In Self Test
      5. 6.3.5 FrameSync Operation
        1. 6.3.5.1 External FrameSync
        2. 6.3.5.2 Internally Generated FrameSync
      6. 6.3.6 GPIO Support
        1. 6.3.6.1 GPIO Status
        2. 6.3.6.2 GPIO Input Control
        3. 6.3.6.3 GPIO Output Control
        4. 6.3.6.4 Forward Channel GPIO
        5. 6.3.6.5 Back Channel GPIO
    4. 6.4 Device Functional Modes
      1. 6.4.1 Clocking Modes
        1. 6.4.1.1 Synchronous Mode
        2. 6.4.1.2 Non-Synchronous Clock Mode
        3. 6.4.1.3 Non-Synchronous Internal Mode
        4. 6.4.1.4 DVP Backwards Compatibility Mode
        5. 6.4.1.5 Configuring CLK_OUT
      2. 6.4.2 MODE
    5. 6.5 Programming
      1. 6.5.1 I2C Interface Configuration
        1. 6.5.1.1 CLK_OUT/IDX
          1. 6.5.1.1.1 IDX
      2. 6.5.2 I2C Interface Operation
      3. 6.5.3 I2C Timing
    6. 6.6 Pattern Generation
      1. 6.6.1 Reference Color Bar Pattern
      2. 6.6.2 Fixed Color Patterns
      3. 6.6.3 Packet Generator Programming
        1. 6.6.3.1 Determining Color Bar Size
      4. 6.6.4 Code Example for Pattern Generator
    7. 6.7 Register Maps
      1. 6.7.1 Main Registers
        1. 6.7.1.1  I2C Device ID Register
        2. 6.7.1.2  Reset
        3. 6.7.1.3  General Configuration
        4. 6.7.1.4  Forward Channel Mode Selection
        5. 6.7.1.5  BC_MODE_SELECT
        6. 6.7.1.6  PLL Clock Control
        7. 6.7.1.7  Clock Output Control 0
        8. 6.7.1.8  Clock Output Control 1
        9. 6.7.1.9  Back Channel Watchdog Control
        10. 6.7.1.10 I2C Control 1
        11. 6.7.1.11 I2C Control 2
        12. 6.7.1.12 SCL High Time
        13. 6.7.1.13 SCL Low Time
        14. 6.7.1.14 Local GPIO DATA
        15. 6.7.1.15 GPIO Input Control
        16. 6.7.1.16 DVP_CFG
        17. 6.7.1.17 DVP_DT
        18. 6.7.1.18 Force BIST Error
        19. 6.7.1.19 Remote BIST Control
        20. 6.7.1.20 Sensor Voltage Gain
        21. 6.7.1.21 Sensor Control 0
        22. 6.7.1.22 Sensor Control 1
        23. 6.7.1.23 Voltage Sensor 0 Thresholds
        24. 6.7.1.24 Voltage Sensor 1 Thresholds
        25. 6.7.1.25 Temperature Sensor Thresholds
        26. 6.7.1.26 CSI-2 Alarm Enable
        27. 6.7.1.27 Alarm Sense Enable
        28. 6.7.1.28 Back Channel Alarm Enable
        29. 6.7.1.29 CSI-2 Polarity Select
        30. 6.7.1.30 CSI-2 LP Mode Polarity
        31. 6.7.1.31 CSI-2 High-Speed RX Enable
        32. 6.7.1.32 CSI-2 Low Power Enable
        33. 6.7.1.33 CSI-2 Termination Enable
        34. 6.7.1.34 CSI-2 Packet Header Control
        35. 6.7.1.35 Back Channel Configuration
        36. 6.7.1.36 Datapath Control 1
        37. 6.7.1.37 Remote Partner Capabilities 1
        38. 6.7.1.38 Partner Deserializer ID
        39. 6.7.1.39 Target 0 ID
        40. 6.7.1.40 Target 1 ID
        41. 6.7.1.41 Target 2 ID
        42. 6.7.1.42 Target 3 ID
        43. 6.7.1.43 Target 4 ID
        44. 6.7.1.44 Target 5 ID
        45. 6.7.1.45 Target 6 ID
        46. 6.7.1.46 Target 7 ID
        47. 6.7.1.47 Target 0 Alias
        48. 6.7.1.48 Target 1 Alias
        49. 6.7.1.49 Target 2 Alias
        50. 6.7.1.50 Target 3 Alias
        51. 6.7.1.51 Target 4 Alias
        52. 6.7.1.52 Target 5 Alias
        53. 6.7.1.53 Target 6 Alias
        54. 6.7.1.54 Target 7 Alias
        55. 6.7.1.55 Back Channel Control
        56. 6.7.1.56 Revision ID
        57. 6.7.1.57 Device Status
        58. 6.7.1.58 General Status
        59. 6.7.1.59 GPIO Pin Status
        60. 6.7.1.60 BIST Error Count
        61. 6.7.1.61 CRC Error Count 1
        62. 6.7.1.62 CRC Error Count 2
        63. 6.7.1.63 Sensor Status
        64. 6.7.1.64 Sensor V0
        65. 6.7.1.65 Sensor V1
        66. 6.7.1.66 Sensor T
        67. 6.7.1.67 CSI-2 Error Count
        68. 6.7.1.68 CSI-2 Error Status
        69. 6.7.1.69 CSI-2 Errors Data Lanes 0 and 1
        70. 6.7.1.70 CSI-2 Errors Data Lanes 2 and 3
        71. 6.7.1.71 CSI-2 Errors Clock Lane
        72. 6.7.1.72 CSI-2 Packet Header Data
        73. 6.7.1.73 Packet Header Word Count 0
        74. 6.7.1.74 Packet Header Word Count 1
        75. 6.7.1.75 CSI-2 ECC
        76. 6.7.1.76 IND_ACC_CTL
        77. 6.7.1.77 IND_ACC_ADDR
        78. 6.7.1.78 IND_ACC_DATA
        79. 6.7.1.79 FPD3_TX_ID0
        80. 6.7.1.80 FPD3_TX_ID1
        81. 6.7.1.81 FPD3_TX_ID2
        82. 6.7.1.82 FPD3_TX_ID3
        83. 6.7.1.83 FPD3_TX_ID4
        84. 6.7.1.84 FPD3_TX_ID5
      2. 6.7.2 Indirect Access Registers
        1. 6.7.2.1 PATGEN Registers
        2. 6.7.2.2 Analog Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power-over-Coax
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 CSI-2 Interface
        2. 7.2.2.2 FPD-Link III Input / Output
        3. 7.2.2.3 Internal Regulator Bypassing
        4. 7.2.2.4 Loop Filter Decoupling
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power-Up Sequencing
        1. 7.3.1.1 System Initialization
          1. 7.3.1.1.1 Code Example for Temperature Ramp Initialization
      2. 7.3.2 Power Down (PDB)
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 CSI-2 Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-826A1C6E-9B3B-4AB8-88CD-EDC90C9AAF0D-low.gif Figure 4-1 RHB Package
32-Pin VQFN
Top View
Table 4-1 Pin Functions
PINI/ODESCRIPTION
NAMENO.
CSI INTERFACE
CSI_CLKP5I, DPHYCSI-2 clock input pins. Connect to a CSI-2 clock source with matched 100Ω (±5%) impedance interconnects.
CSI_CLKN6I, DPHY
CSI_D0P3I, DPHYCSI-2 data input pins. Connect to a CSI-2 data sources with matched 100Ω (±5%) impedance interconnects. If unused, these pins can be left floating.
CSI_D0N4I, DPHY
CSI_D1P1I, DPHY
CSI_D1N2I, DPHY
CSI_D2P31I, DPHY
CSI_D2N32I, DPHY
CSI_D3P29I, DPHY
CSI_D3N30I, DPHY
SERIAL CONTROL INTERFACE
I2C_SDA23ODI2C Data and Clock Pins. Pulled up to either 1.8V or 3.3V supply rail depending on IDX setting. See I2C Interface Configuration for further details on the I2C implementation of the DS90UB935-Q1. See I2C Bus Pullup Resistor Calculation (SVLA689).
I2C_SCL24OD
CONFIGURATION and CONTROL
RES07IReserved pin – Connect to GND
RES122IReserved pin – Do not connect (leave floating)
PDB8I, PDPower-down inverted Input Pin. Internal 1MΩ pulldown. Typically connected to processor GPIO with pull down. When PDB input is brought HIGH, the device is enabled and internal register and state machines are reset to default values. Asserting PDB signal low powers down the device and consumes minimum power. The default function of this pin is PDB = LOW; POWER DOWN. PDB remains low until after power supplies are applied and reach minimum required levels. See Power Down (PDB) for further details on the function of PDB.
PDB INPUT IS NOT 3.3V TOLERANT.
PDB = 1.8V, device is enabled (normal operation)
PDB = 0, device is powered down.
MODE21I, SMode select configuration input. Default operational mode is strapped at start-up based on the MODE input voltage when PDB transitions LOW to HIGH. Typically connected to voltage divider through external pullup to VDD18 and pulldown to GND applying an appropriate bias voltage. See MODE for details.
CLK_OUT/IDX19I/O, SIDX pin sets the I2C pullup voltage and device address; connect to external pullup to VDD and pulldown to GND to create a voltage divider. When PDB transitions LOW to HIGH, the strap input voltage is sensed at the CLOCK_OUT/IDX pin to determine functionality and then converted to CLK_OUT. See I2C Interface Configuration for details. If CLK_OUT is used, the minimum resistance on the pin is 35kΩ. If unused, CLK_OUT/IDX can be tied to GND.
FPD-LINK III INTERFACE
DOUT-13I/OFPD-Link III Input/Output pins. These pins must be AC-coupled. See Figure 7-5 and Figure 7-6 for typical connection diagrams and Table 7-3 for recommended capacitor values.
DOUT+14I/O
POWER AND GROUND
VDDD_CAP26D, PA connection for an internal analog regulator decoupling capacitor. Typically connected to 10µF, 0.1µF, and 0.01µF capacitors to GND. Do not connect to an external supply rail. See Typical Application for more details.
VDDDRV_CAP15D, PA connection for an internal analog regulator decoupling capacitor. Typically connected to 10µF, 0.1µF, and 0.01µF capacitors to GND. Do not connect to an external supply rail. See Typical Application for more details.
VDDPLL_CAP10D, PA connection for an internal analog regulator decoupling capacitor. Typically connected to 10µF, 0.1µF, and 0.01µF capacitors to GND. Do not connect to an external supply rail. See Typical Application for more details.
VDDD25P1.8V (±5%) Power Supply pin.
Typically connected to 1µF and 0.01µF capacitors to GND.
VDDDRV16P1.8V (±5%) Analog Power Supply pin.
Typically connected to 1µF and 0.01µF capacitors to GND.
VDDPLL11P1.8V (±5%) Analog Power Supply pin.
Typically connected to 1µF and 0.01µF capacitors to GND.
GNDDAPGDAP is the large metal contact at the bottom side, located at the center of the VQFN package. Connect to the ground plane (GND).
LOOP FILTER
LPF19PLoop Filter 1: Connect as described in Section 7.2.2.4.
LPF212PLoop Filter 2: Connect as described in Section 7.2.2.4.
CLOCK INTERFACE AND GPIO
GPIO_017I/O, PDGeneral-Purpose Input/Output pins. These pins can also be configured to sense the voltage at their inputs. See Voltage and Temperature Sensing. At power up, these GPIO pins default to inputs with a 300kΩ (typical) internal pulldown resistor. These pins can be left floating if unused, but TI recommends to set the GPIOx_INPUT_EN to 0 to disable the pins. See Section 6.3.6 for programmability.
GPIO_118I/O, PD
GPIO_227I/O, PDGeneral-Purpose Input/Output pins. At power up, these GPIO pins default to inputs with a 300kΩ (typical) internal pulldown resistor. These pins can be left floating if unused, but TI recommends to set the GPIOx_INPUT_EN to 0 to disable the pins. See Section 6.3.6 for programmability.
GPIO_328I/O. PD
CLKIN20IReference Clock Input pin. If operating in non-sync external clock mode, connect this pin to a local clock source. If unused (like other clocking modes), this pin can be left open. See Table 6-8 for more information on clocking modes.