SNLS477D October   2014  – February 2022 DS90UB948-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  Timing Requirements for the Serial Control Bus
    8. 6.8  Switching Characteristics
    9. 6.9  Timing Diagrams and Test Circuits
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Speed Forward Channel Data Transfer
      2. 7.3.2  Low-Speed Back Channel Data Transfer
      3. 7.3.3  FPD-Link III Port Register Access
      4. 7.3.4  Oscillator Output
      5. 7.3.5  Clock and Output Status
      6. 7.3.6  LVCMOS VDDIO Option
      7. 7.3.7  Power Down (PDB)
      8. 7.3.8  Interrupt Pin — Functional Description and Usage (INTB_IN)
      9. 7.3.9  General-Purpose I/O (GPIO)
        1. 7.3.9.1 GPIO[3:0] and D_GPIO[3:0] Configuration
        2. 7.3.9.2 Back Channel Configuration
        3. 7.3.9.3 GPIO Register Configuration
      10. 7.3.10 SPI Communication
        1. 7.3.10.1 SPI Mode Configuration
        2. 7.3.10.2 Forward Channel SPI Operation
        3. 7.3.10.3 Reverse Channel SPI Operation
      11. 7.3.11 Backward Compatibility
      12. 7.3.12 Adaptive Equalizer
        1. 7.3.12.1 Transmission Distance
        2. 7.3.12.2 Adaptive Equalizer Algorithm
        3. 7.3.12.3 AEQ Settings
          1. 7.3.12.3.1 AEQ Start-Up and Initialization
          2. 7.3.12.3.2 AEQ Range
          3. 7.3.12.3.3 AEQ Timing
      13. 7.3.13 I2S Audio Interface
        1. 7.3.13.1 I2S Transport Modes
        2. 7.3.13.2 I2S Repeater
        3. 7.3.13.3 I2S Jitter Cleaning
        4. 7.3.13.4 MCLK
      14. 7.3.14 Repeater
        1. 7.3.14.1 Repeater Configuration
        2. 7.3.14.2 Repeater Connections
          1. 7.3.14.2.1 Repeater Fan-Out Electrical Requirements
      15. 7.3.15 Built-In Self Test (BIST)
        1. 7.3.15.1 BIST Configuration and Status
          1. 7.3.15.1.1 Sample BIST Sequence
        2. 7.3.15.2 Forward Channel and Back Channel Error Checking
      16. 7.3.16 Internal Pattern Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Configuration Select MODE_SEL[1:0]
        1. 7.4.1.1 1-Lane FPD-Link III Input, Single Link OpenLDI Output
        2. 7.4.1.2 1-Lane FPD-Link III Input, Dual Link OpenLDI Output
        3. 7.4.1.3 2-Lane FPD-Link III Input, Dual Link OpenLDI Output
        4. 7.4.1.4 2-Lane FPD-Link III Input, Single Link OpenLDI Output
        5. 7.4.1.5 1-Lane FPD-Link III Input, Single Link OpenLDI Output (Replicate)
      2. 7.4.2 MODE_SEL[1:0]
        1. 7.4.2.1 Dual Swap
      3. 7.4.3 OpenLDI Output Frame and Color Bit Mapping Select
    5. 7.5 Image Enhancement Features
      1. 7.5.1 White Balance
      2. 7.5.2 LUT Contents
      3. 7.5.3 Enabling White Balance
        1. 7.5.3.1 LUT Programming Example
      4. 7.5.4 Adaptive Hi-FRC Dithering
    6. 7.6 Programming
      1. 7.6.1 Serial Control Bus
      2. 7.6.2 Multi-Controller Arbitration Support
      3. 7.6.3 I2C Restrictions on Multi-Controller Operation
      4. 7.6.4 Multi-Controller Access to Device Registers for Newer FPD-Link III Devices
      5. 7.6.5 Multi-Controller Access to Device Registers for Older FPD-Link III Devices
      6. 7.6.6 Restrictions on Control Channel Direction for Multi-Controller Operation
    7. 7.7 Register Maps
      1. 7.7.1 DS90UB948-Q1 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 FPD-Link III Interconnect Guidelines
        2. 8.2.2.2 AV Mute Prevention
        3. 8.2.2.3 Prevention of I2C Errors During Abrupt System Faults
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
    2. 9.2 Power Sequence
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Ground
    3. 10.3 Routing FPD-Link III Signal Traces
    4. 10.4 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per AEC Q100-002(1)±8000V
Charged-device model (CDM), per AEC Q100-011±1250
ESD Ratings (IEC 61000-4-2)
RD = 330 Ω, CS = 150 pF		Contact Discharge
(RIN0+, RIN0-, RIN1+, RIN1–)		±8000
Air-gap Discharge
(RIN0+, RIN0-, RIN1+, RIN1–)		±15000
ESD Ratings (ISO10605)
RD = 330 Ω, CS = 150 and 330 pF
RD = 2 kΩ, CS = 150 and 330 pF		Contact Discharge (RIN0+, RIN0-, RIN1+, RIN1-)±8000
Air-gap Discharge
(RIN0+, RIN0–, RIN1+, RIN1–)		±15000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.