SNLS573B August 2018 – September 2023 DS90UB962-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
TI recommends that a consistent ground plane reference for the high-speed signals in the PCB design to provide the best image plane for signal traces running parallel to the plane. Connect the thermal pad of the DS90UB962-Q1 to this plane with vias.