SNLS573B August 2018 – September 2023 DS90UB962-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | DS90UB962-Q1 | UNIT | |
---|---|---|---|
RTD (VQFN) | |||
64 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 23.8 | °C/W |
RθJC(TOP) | Junction-to-case (top) thermal resistance | 10.4 | °C/W |
RθJC(BOT) | Junction-to-case (bottom) thermal resistance | 0.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 7.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 7.5 | °C/W |