SNLS337M October   2010  – August 2017 DS90UH926Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC and AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing Requirements for the Serial Control Bus
    9. 6.9  Switching Characteristics
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Speed Forward Channel Data Transfer
      2. 7.3.2  Low-Speed Back Channel Data Transfer
      3. 7.3.3  Backward Compatible Mode
      4. 7.3.4  Input Equalization Gain
      5. 7.3.5  Common-Mode Filter Pin (CMF)
      6. 7.3.6  Video Control Signal Filter
      7. 7.3.7  EMI Reduction Features
        1. 7.3.7.1 Spread Spectrum Clock Generation (SSCG)
      8. 7.3.8  Enhanced Progressive Turnon (EPTO)
      9. 7.3.9  LVCMOS VDDIO Option
      10. 7.3.10 Power Down (PDB)
      11. 7.3.11 Stop Stream Sleep
      12. 7.3.12 Serial Link Fault Detect
      13. 7.3.13 Oscillator Output
      14. 7.3.14 Pixel Clock Edge Select (RFB)
      15. 7.3.15 Built In Self Test (BIST)
        1. 7.3.15.1 BIST Configuration and Status
          1. 7.3.15.1.1 Sample BIST Sequence
        2. 7.3.15.2 Forward-Channel and Back-Channel Error Checking
      16. 7.3.16 Image Enhancement Features
        1. 7.3.16.1 White Balance
          1. 7.3.16.1.1 LUT Contents
          2. 7.3.16.1.2 Enabling White Balance
        2. 7.3.16.2 Adaptive HI-FRC Dithering
      17. 7.3.17 Internal Pattern Generation
      18. 7.3.18 I2S Receiving
        1. 7.3.18.1 I2S Jitter Cleaning
        2. 7.3.18.2 Secondary I2S Channel
          1. 7.3.18.2.1 MCLK
      19. 7.3.19 Interrupt Pin: Functional Description and Usage (INTB)
      20. 7.3.20 GPIO[3:0] and GPO_REG[8:4]
        1. 7.3.20.1 GPIO[3:0] Enable Sequence
        2. 7.3.20.2 GPO_REG[8:4] Enable Sequence
    4. 7.4 Device Functional Modes
      1. 7.4.1 Clock-Data Recovery Status Flag (LOCK), Output Enable (OEN), and Output State Select (OSS_SEL)
      2. 7.4.2 Low Frequency Optimization (LFMODE)
      3. 7.4.3 Configuration Select (MODE_SEL)
      4. 7.4.4 HDCP Repeater
        1. 7.4.4.1 Repeater Connections
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Display Application
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Transmission Media
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 CML Interconnect Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.