SNLS458B November   2014  – August 2019 DS90UH929-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  DC And AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing for the Serial Control Bus
    9. 6.9  Timing Diagrams
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Definition Multimedia Interface (HDMI)
        1. 7.3.1.1 HDMI Receive Controller
      2. 7.3.2  Transition Minimized Differential Signaling
      3. 7.3.3  Enhanced Display Data Channel
      4. 7.3.4  Extended Display Identification Data (EDID)
        1. 7.3.4.1 External Local EDID (EEPROM)
        2. 7.3.4.2 Internal EDID (SRAM)
        3. 7.3.4.3 External Remote EDID
        4. 7.3.4.4 Internal Pre-Programmed EDID
      5. 7.3.5  Consumer Electronics Control (CEC)
      6. 7.3.6  +5-V Power Signal
      7. 7.3.7  Hot Plug Detect (HPD)
      8. 7.3.8  High-Speed Forward Channel Data Transfer
      9. 7.3.9  Back Channel Data Transfer
      10. 7.3.10 Power Down (PDB)
      11. 7.3.11 Serial Link Fault Detect
      12. 7.3.12 Interrupt Pin (INTB)
      13. 7.3.13 Remote Interrupt Pin (REM_INTB)
      14. 7.3.14 General-Purpose I/O
        1. 7.3.14.1 GPIO[3:0] Configuration
        2. 7.3.14.2 GPIO_REG[8:5] Configuration
      15. 7.3.15 Backward Compatibility
      16. 7.3.16 Audio Modes
        1. 7.3.16.1 HDMI Audio
        2. 7.3.16.2 DVI I2S Audio Interface
          1. 7.3.16.2.1 I2S Transport Modes
          2. 7.3.16.2.2 I2S Repeater
        3. 7.3.16.3 AUX Audio Channel
        4. 7.3.16.4 TDM Audio Interface
      17. 7.3.17 HDCP
        1. 7.3.17.1 HDCP I2S Audio Encryption
      18. 7.3.18 Built-In Self Test (BIST)
        1. 7.3.18.1 BIST Configuration And Status
        2. 7.3.18.2 Forward Channel and Back Channel Error Checking
      19. 7.3.19 Internal Pattern Generation
        1. 7.3.19.1 Pattern Options
        2. 7.3.19.2 Color Modes
        3. 7.3.19.3 Video Timing Modes
        4. 7.3.19.4 External Timing
        5. 7.3.19.5 Pattern Inversion
        6. 7.3.19.6 Auto Scrolling
        7. 7.3.19.7 Additional Features
      20. 7.3.20 Spread Spectrum Clock Tolerance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Select Configuration Settings (MODE_SEL[1:0])
      2. 7.4.2 FPD-Link III Single Link Operation
      3. 7.4.3 Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
    5. 7.5 Programming
      1. 7.5.1 Serial Control Bus
      2. 7.5.2 Multi-Master Arbitration Support
      3. 7.5.3 I2C Restrictions on Multi-Master Operation
      4. 7.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 7.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 7.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Applications Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 High-Speed Interconnect Guidelines
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Application Performance Plots
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 AC Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS PIN/FREQ. MIN TYP MAX UNIT
GPIO FREQUENCY(4)
Rb,FC Forward Channel GPIO Frequency IN_CLK = 25 MHz - 96 MHz GPIO[3:0] 0.25 × IN_CLK MHz
tGPIO,FC GPIO Pulse Width, Forward Channel IN_CLK = 25 MHz - 96 MHz GPIO[3:0] >2 / IN_CLK s
TMDS INPUT
Skew-Intra Maximum Intra-Pair Skew IN_CLK±, IN_D[2:0]± 0.4 UITMDS(1)
Skew-Inter Maximum Inter-Pair Skew 0.2 × Tchar(2) + 1.78 ns
tIJIT TMDS Clock Input Jitter Bit Error Rate ≤1E-10 IN_CLK± 0.3 UITMDS(1)
FPD-LINK III OUTPUT
tLHT Low Voltage Differential Low-to-High Transition Time   80 ps
tHLT Low Voltage Differential High-to-Low Transition Time 80 ps
tXZD Output Active to OFF Delay PDB = L 100 ns
tPLD Lock Time (HDMI Rx) 5 ms
tSD Delay — Latency IN_CLK± 145*T(1) s
tDJIT Output Total Jitter (Figure 5 ) Random Pattern Low pass filter IN_CLK/20 0.3 UIFPD3(3)
λSTXBW Jitter Transfer Function (-3-dB Bandwidth) 960 kHz
δSTX Jitter Transfer Function Peaking 0.1 dB
(1) One bit period of the TMDS input.
(2) Ten bit periods of the TMDS input.
(3) One bit period of the serializer output.
(4) Back channel rates are available on the companion deserializer datasheet.