SNLS231P September   2006  – August 2024 DS90UR124-Q1 , DS90UR241-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Serializer Input Timing Requirements for TCLK
    7. 5.7 Serializer Switching Characteristics
    8. 5.8 Deserializer Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Initialization and Locking Mechanism
      2. 6.3.2  Data Transfer
      3. 6.3.3  Resynchronization
      4. 6.3.4  Powerdown
      5. 6.3.5  Tri-State
      6. 6.3.6  Pre-Emphasis
      7. 6.3.7  AC-Coupling and Termination
        1. 6.3.7.1 Receiver Termination Option 1
        2. 6.3.7.2 Receiver Termination Option 2
        3. 6.3.7.3 Receiver Termination Option 3
      8. 6.3.8  Signal Quality Enhancers
      9. 6.3.9  @SPEED-BIST Test Feature
      10. 6.3.10 Backward-Compatible Mode With DS90C241 and DS90C124
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Using the DS90UR241 and DS90UR124
      2. 7.1.2 Display Application
      3. 7.1.3 Typical Application Connection
    2. 7.2 Typical Applications
      1. 7.2.1 DS90UR241-Q1 Typical Application Connection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Power Considerations
          2. 7.2.1.2.2 Noise Margin
          3. 7.2.1.2.3 Transmission Media
          4. 7.2.1.2.4 46
          5. 7.2.1.2.5 Live Link Insertion
        3. 7.2.1.3 Application Curves
      2. 7.2.2 DS90UR124 Typical Application Connection
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Layout and Power System Considerations
        2. 7.4.1.2 LVDS Interconnect Guidelines
      2. 7.4.2 Layout Examples
  9. 7Device and Documentation Support
    1. 7.1 Device Support
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  10. 8Revision History
  11.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

5.7 Serializer Switching Characteristics

over recommended operating supply and temperature ranges unless otherwise specified
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tLLHTLVDS Low-to-High Transition TimeRL = 100Ω, VODSEL = L,
CL = 10pF to GND, Figure 5-3		245550ps
tLHLTLVDS High-to-Low Transition Time264550ps
tDISDIN (0:23) Setup to TCLKRL = 100Ω, CL = 10pF to GND
Figure 5-5		4ns
tDIHDIN (0:23) Hold from TCLK4ns
tHZDDOUT ± HIGH to Tri-state DelayRL = 100Ω,
CL = 10pF to GND
Figure 5-6		1015ns
tLZDDOUT ± LOW to Tri-state Delay1015ns
tZHDDOUT ± Tri-state to HIGH Delay75150ns
tZLDDOUT ± Tri-state to LOW Delay75150ns
tPLDSerializer PLL Lock TimeRL = 100Ω10ms
tSDSerializer DelayRL = 100Ω, PRE = OFF,
RAOFF = L, TRFB = H,
Figure 5-8		3.5T+23.5T+10ns
RL = 100Ω, PRE = OFF,
RAOFF = L, TRFB = L,
Figure 5-8		3.5T+23.5T+10
TxOUT_E_OTxOUT_Eye_Opening.
TxOUT_E_O centered on (tBIT/)2		5MHz–43MHz,
RL = 100Ω, CL = 10pF to GND,
RANDOM pattern
Figure 5-9		0.760.84UI