SNLS231P September   2006  – August 2024 DS90UR124-Q1 , DS90UR241-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Serializer Input Timing Requirements for TCLK
    7. 5.7 Serializer Switching Characteristics
    8. 5.8 Deserializer Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Initialization and Locking Mechanism
      2. 6.3.2  Data Transfer
      3. 6.3.3  Resynchronization
      4. 6.3.4  Powerdown
      5. 6.3.5  Tri-State
      6. 6.3.6  Pre-Emphasis
      7. 6.3.7  AC-Coupling and Termination
        1. 6.3.7.1 Receiver Termination Option 1
        2. 6.3.7.2 Receiver Termination Option 2
        3. 6.3.7.3 Receiver Termination Option 3
      8. 6.3.8  Signal Quality Enhancers
      9. 6.3.9  @SPEED-BIST Test Feature
      10. 6.3.10 Backward-Compatible Mode With DS90C241 and DS90C124
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Using the DS90UR241 and DS90UR124
      2. 7.1.2 Display Application
      3. 7.1.3 Typical Application Connection
    2. 7.2 Typical Applications
      1. 7.2.1 DS90UR241-Q1 Typical Application Connection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Power Considerations
          2. 7.2.1.2.2 Noise Margin
          3. 7.2.1.2.3 Transmission Media
          4. 7.2.1.2.4 46
          5. 7.2.1.2.5 Live Link Insertion
        3. 7.2.1.3 Application Curves
      2. 7.2.2 DS90UR124 Typical Application Connection
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Layout and Power System Considerations
        2. 7.4.1.2 LVDS Interconnect Guidelines
      2. 7.4.2 Layout Examples
  9. 7Device and Documentation Support
    1. 7.1 Device Support
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  10. 8Revision History
  11.   Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT
Supply Voltage (VDD)–0.34V
LVCMOS Input Voltage–0.3VDD +0.3V
LVCMOS Output Voltage–0.3VDD +0.3V
LVDS Receiver Input Voltage–0.3+3.9V
LVDS Driver Output Voltage–0.3+3.9V
LVDS Output Short Circuit Duration10ms
Junction Temperature150°C
Lead Temperature (Soldering, 4 seconds)260°C
Maximum Package Power Dissipation Capacity(2)Package
Derating:		DS90UR241 − 48L TQFPRθJA45.8 (4L);
75.4 (2L)		°C/W
RθJC21.0
DS90UR124 − 64L TQFPRθJA42.8 (4L);
67.2 (2L)
RθJC14.6
Storage temperature, Tstg–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) 1/RθJA °C/W above +25°C