SNLS346C August   2011  – June 2014 DS90UR903Q-Q1 , DS90UR904Q-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Recommended Serializer Timing for PCLK
    7. 6.7  Serial Control Bus AC Timing Specifications (SCL, SDA) - I2C Compliant (See )
    8. 6.8  Serial Control Bus DC Characteristics (SCL, SDA) - I2C Compliant
    9. 6.9  Serializer Switching Characteristics
    10. 6.10 Deserializer Switching Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 Typical Application Diagram
      2. 7.2.2 Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Serial Frame Format
      2. 7.3.2 Signal Quality Enhancers
        1. 7.3.2.1 Des - Receiver Input Equalization (EQ)
      3. 7.3.3 Emi Reduction
        1. 7.3.3.1 Des - Receiver Staggered Output
        2. 7.3.3.2 Des Spread Spectrum Clocking
    4. 7.4 Device Functional Modes
      1. 7.4.1 LVCMOS VDDIO Option
      2. 7.4.2 Powerdown
      3. 7.4.3 Pixel Clock Edge Select (TRFB/RRFB)
    5. 7.5 Programming
      1. 7.5.1 Description of Serial Control Bus
      2. 7.5.2 ID[X] Address Decoder
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Typical Application Connection
        2. 8.2.2.2 AC Coupling
        3. 8.2.2.3 Power Up Requirements and PDB PIN
        4. 8.2.2.4 Transmission Media
        5. 8.2.2.5 Serial Interconnect Guidelines
        6. 8.2.2.6 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

  • Soldering Specifications Application Report, SNOA549
  • IC Package Thermal Metrics Application Report, SPRA953
  • Channel-Link PCB and Interconnect Design-In Guidelines, SNLA008
  • Transmission Line RAPIDESIGNER Operation and Application Guide, SNLA035
  • Leadless Leadframe Package (LLP) Application Report, SNOA401
  • LVDS Owner's Manual, SNLA187

11.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
DS90UR903Q-Q1 Click here Click here Click here Click here Click here
DS90UR904Q-Q1 Click here Click here Click here Click here Click here

11.3 Trademarks

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.