SNLS302E May   2010  – February 2015 DS92LV2411 , DS92LV2412

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Typical Application Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Serializer DC Electrical Characteristics
    6. 6.6  Deserializer DC Electrical Characteristics
    7. 6.7  DC and AC Serial Control Bus Characteristics
    8. 6.8  Recommended Timing For The Serial Control Bus
    9. 6.9  Recommended Serializer Timing For CLKIN
    10. 6.10 Serializer Switching Characteristics
    11. 6.11 Deserializer Switching Characteristics
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Serializer Functional Description
        1. 7.3.1.1 EMI Reduction Features
          1. 7.3.1.1.1 Data Randomization and Scrambling
          2. 7.3.1.1.2 Ser — Spread Spectrum Compatibility
        2. 7.3.1.2 Integrated Signal Conditioning Features — Ser
          1. 7.3.1.2.1 Ser — VOD Select (VODSEL)
          2. 7.3.1.2.2 Ser — De-Emphasis (De-Emph)
        3. 7.3.1.3 Power Saving Features
          1. 7.3.1.3.1 Ser — Power Down Feature (PDB)
          2. 7.3.1.3.2 Ser — Stop Clock Feature
          3. 7.3.1.3.3 1.8 V or 3.3 V VDDIO Operation
        4. 7.3.1.4 Ser — Pixel Clock Edge Select (RFB)
        5. 7.3.1.5 Optional Serial Bus Control
        6. 7.3.1.6 Optional BIST Mode
      2. 7.3.2 Deserializer Functional Description
        1. 7.3.2.1  Integrated Signal Conditioning Features — Des
          1. 7.3.2.1.1 Des — Input Equalizer Gain (Eq)
        2. 7.3.2.2  EMI Reduction Features
          1. 7.3.2.2.1 Des — Output Slew Rate Select (OS_CLKOUT/OS_DATA)
          2. 7.3.2.2.2 Des — Common Mode Filter Pin (CMF) — Optional
          3. 7.3.2.2.3 Des — SSCG Generation — Optional
          4. 7.3.2.2.4 1.8 V or 3.3 V VDDIO Operation
        3. 7.3.2.3  Power Saving Features
          1. 7.3.2.3.1 Des — Powerdown Feature (PDB)
          2. 7.3.2.3.2 Des — Stop Stream Sleep Feature
        4. 7.3.2.4  Des — Clock-Data Recovery Status Flag (Lock) And Output State Select (OSS_SEL)
        5. 7.3.2.5  Des — Oscillator Output — Optional
        6. 7.3.2.6  Des — OP_LOW — Optional
        7. 7.3.2.7  Des — Clock Edge Select (RFB)
        8. 7.3.2.8  Des — Control Signal Filter — Optional
        9. 7.3.2.9  Des — SSCG Low Frequency Optimization (Lf_mode)
        10. 7.3.2.10 Des — Strap Input Pins
      3. 7.3.3 Built In Self Test (BIST)
        1. 7.3.3.1 Sample BIST Sequence
        2. 7.3.3.2 BER Calculations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Data Transfer
      2. 7.4.2 Serializer and Deserializer Operating Modes and Reverse Compatibility (Config[1:0])
      3. 7.4.3 Video Control Signal Filter — Serializer and Deserializer
    5. 7.5 Programming
      1. 7.5.1 Optional Serial Bus Control
    6. 7.6 Register Maps
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Typical Application Connection
        2. 8.2.2.2 Power Up Requirements and PDB Pin
        3. 8.2.2.3 Transmission Media
        4. 8.2.2.4 Live Link Insertion
        5. 8.2.2.5 Serial Interconnect Guidelines
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(12)(1)(1)

MIN MAX UNIT
Supply Voltage – VDDn (1.8 V) −0.3 2.5 V
Supply Voltage – VDDIO −0.3 4.0 V
LVCMOS I/O Voltage −0.3 (VDDIO + 0.3) V
Receiver Input Voltage −0.3 (VDD + 0.3) V
Driver Output Voltage −0.3 (VDD + 0.3) V
Junction Temperature +150 °C
Storage Temperature Range (Tstg) −65 +150 °C
(1) For soldering specifications, see product folder at www.ti.com and http://www.ti.com/lit/SNOA549

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±8000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine Model (MM) ±250
IEC61000–4–2), RD = 330Ω, CS = 150pF
V(ESD) Electrostatic discharge Air Discharge (DOUT+, DOUT-) ±2500 V
Contact Discharge (DOUT+, DOUT-) ±800
Air Discharge (RIN+, DIN-) ±2500
Contact Discharge (RIN+, RIN-) ±800
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible if necessary precautions are taken. Pins listed as DOUT+, DOUT- or RIN+, DIN- may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible if necessary precautions are taken. Pins listed as DOUT+, DOUT- or RIN+, DIN- may actually have higher performance.

6.3 Recommended Operating Conditions

MIN TYP MAX UNIT
Supply Voltage (VDDn) 1.71 1.8 1.89 V
LVCMOS Supply Voltage (VDDIO) 1.71 1.8 1.89 V
OR
LVCMOS Supply Voltage (VDDIO) 3.0 3.3 3.6 V
Operating Free Air Temperature (TA) −40 +25 +85 °C
Clock Frequency 5 50 MHz
Supply Noise(10) 50 mVP-P

6.4 Thermal Information

THERMAL METRIC(1) RHS(2) NKB(3) UNIT
48 PINS 60 PINS
RθJA Junction-to-ambient thermal resistance 27.1 24.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 4.5 2.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Ratings for maximum dissipation capacity (215 mW).
(3) Ratings for maximum dissipation capacity (478 mW).

6.5 Serializer DC Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.(2)(3)(4)
PARAMETER TEST CONDITIONS PIN/FREQ. MIN TYP MAX UNIT
LVCMOS INPUT DC SPECIFICATIONS
VIH High Level Input Voltage VDDIO = 3.0 to 3.6V DI[23:0], CI1,CI2,CI3, CLKIN, PDB, VODSEL, RFB, BISTEN, CONFIG[1:0] 2.2 VDDIO V
VDDIO = 1.71 to 1.89V 0.65*
VDDIO		 VDDIO
VIL Low Level Input Voltage VDDIO = 3.0 to 3.6V GND 0.8 V
VDDIO = 1.71 to 1.89V GND 0.35*
VDDIO
IIN Input Current VIN = 0V or VDDIO VDDIO = 3.0 to 3.6V –15 ±1 +15 μA
VDDIO = 1.71 to 1.89V –15 ±1 +15
CML DRIVER DC SPECIFICATIONS
VOD Differential Output Voltage RL = 100Ω, De-emph = disabled, Figure 2 VODSEL = 0 DOUT+, DOUT- ±205 ±280 ±355 mV
VODSEL = 1 ±320 ±420 ±520
VODp-p Differential Output Voltage (DOUT+) – (DOUT-) VODSEL = 0 560 mVp-p
VODSEL = 1 840 mVp-p
ΔVOD RL = 100Ω, De-emph = disabled, VODSEL = L 1 50 mV
VOS Offset Voltage – Single-ended At TP A and B, Figure 1 RL = 100Ω, De-emph = disabled VODSEL = 0 0.65 V
VODSEL = 1 1.575 V
ΔVOS Offset Voltage Unbalance Single-ended At TP A and B, Figure 1 RL = 100Ω, De-emph = disabled 1 mV
IOS Output Short Circuit Current DOUT+/- = 0V, De-emph = disabled VODSEL = 0 –36 mA
RTO Internal Output Termination Resistor 80 100 120 Ω
SUPPLY CURRENT
IDDT1 Serializer Supply Current (includes load current) RL = 100 Ω, CLKIN = 50 MHz Checker Board Pattern, De-emph = 3kΩ, VODSEL = H, Figure 9 VDD = 1.89V All VDD Pins 75 85 mA
VDDIO = 1.89V VDDIO 3 5 mA
IDDIOT1 VDDIO = 3.6V 11 15 mA
IDDT2 Checker Board Pattern, De-emph = 6kΩ, VODSEL = L, Figure 9 VDD33 = 1.89V All VDD Pins 65 75 mA
VDDIO = 1.89V VDDIO 3 5 mA
IDDIOT2 VDDIO = 3.6V 11 15 mA
IDDZ Serializer Supply Current Power-down PDB = 0V , (All other LVCMOS Inputs = 0V) VDD33 = 1.89V All VDD Pins 40 1000 µA
VDDIO = 1.89V VDDIO 5 10 µA
IDDIOZ VDDIO = 3.6V 10 20 µA

6.6 Deserializer DC Electrical Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.(2)(3)(4)
PARAMETER TEST CONDITIONS PIN/FREQ. MIN TYP MAX UNIT
3.3 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 3.0 to 3.6V
VIH High Level Input Voltage PDB, BISTEN 2.2 VDDIO V
VIL Low Level Input Voltage GND 0.8 V
IIN Input Current VIN = 0V or VDDIO –15 ±1 +15 μA
VOH High Level Output Voltage IOH = −0.5 mA, RDS = L DO[23:0], CO1, CO2, CO3, CLKOUT, LOCK, PASS 2.4 VDDIO V
V
VOL Low Level Output Voltage IOL = +0.5 mA, RDS = L GND 0.4 V
IOS Output Short Circuit Current VDDIO = 3.3V, VOUT = 0V, OS_PCLK/DATA = L/H CLKOUT 36 mA
VDDIO = 3.3V, VOUT = 0V, OS_PCLK/DATA = L/H Outputs
IOZ TRI-STATE Output Current PDB = 0V, OSS_SEL = 0V, VOUT = H Outputs –15 +15 μA
1.8 V I/O LVCMOS DC SPECIFICATIONS – VDDIO = 1.71 to 1.89V
VIH High Level Input Voltage PDB, BISTEN 1.235 VDDIO V
VIL Low Level Input Voltage GND 0.595 V
IIN Input Current VIN = 0V or VDDIO –15 ±1 +15 µA
VOH High Level Output Voltage IOH = −0.5 mA, RDS = L DO[23:0], CO1, CO2, CO3, CLKOUT, LOCK, PASS VDDIO – 0.45 VDDIO V
VOL Low Level Output Voltage IOL = +0.5 mA, RDS = L GND 0.45 V
IOS Output Short Circuit Current VDDIO = 1.8V, VOUT = 0V, OS_PCLK/DATA = L/H CLKOUT 18 mA
VDDIO = 1.8V, VOUT = 0V, OS_PCLK/DATA = L/H Outputs 18 mA
IOZ TRI-STATE Output Current PDB = 0V, OSS_SEL = 0V, VOUT = H Outputs –15 +15 µA
CML RECEIVER DC SPECIFICATIONS
VTH Differential Input Threshold High Voltage VCM = +1.2V (Internal VBIAS) RIN+, RIN- +50 mV
VTL Differential Input Threshold Low Voltage –50 mV
VCM Common Mode Voltage, Internal VBIAS 12 V
IIN Input Current VIN = 0V or VDDIO –15 +15 µA
RTI Internal Input Termination Resistor RIN+, RIN- 80 100 120 Ω
LOOP THROUGH CML DRIVER OUTPUT DC SPECIFICATIONS – EQ TEST PORT
VOD Differential Output Voltage RL = 100Ω ROUT+/- 542 mV
VOS Offset Voltage Single-ended RL = 100Ω 1.4 V
RT Internal Termination Resistor ROUT+/- 80 100 120 Ω
SUPPLY CURRENT
IDD1 Deserializer
Supply Current
(includes load current)
CLKOUT = 50 MHz		 Checker Board Pattern, RDS = H, CL = 4pF,
Figure 9		 VDD = 1.89V All VDD Pins 93 110 mA
VDDIO = 1.89V VDDIO 33 45 mA
IDDIO1 VDDIO = 3.6V 62 75 mA
IDDZ Deserializer Supply Current Power Down PDB = 0V, All other LVCMOS Inputs = 0V VDD = 1.89V All VDD Pins 40 3000 µA
VDDIO = 1.89V VDDIO 5 50 µA
IDDIOZ VDDIO = 3.6V 10 100 µA

6.7 DC and AC Serial Control Bus Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIH Input High Level SDA and SCL 2.2 VDD 3.3V V
VIL Input Low Level Voltage SDA and SCL GND 0.8 V
VHY Input Hysteresis >50 mV
VOL Output Low Voltage(11) SDA, IOL = 1.25mA, VDDIO = 3.3V 0 0.4 V
Iin SDA or SCL, Vin = VDDIO or GND -15 +15 µA
tR SDA RiseTime – READ SDA, RPU = X, Cb ≤ 400pF 40 ns
tF SDA Fall Time – READ 25 ns
tSU;DAT Set Up Time — READ 520 ns
tHD;DAT Hold Up Time — READ 55 ns
tSP Input Filter 50 ns
Cin Input Capacitance SDA or SCL <5 pF
(1) “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur, including inoperability and degradation of device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or other conditions beyond those indicated in the Recommended Operating Conditions is not implied. The Recommended Operating Conditions indicate conditions at which the device is functional and the device should not be operated beyond such conditions.
(2) The Electrical Characteristics tables list ensured specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not ensured.
(3) Typical values represent most likely parametric norms at VDD = 3.3V, Ta = +25 degC, and at the Recommended Operation Conditions at the time of product characterization and are not ensured.
(4) Current into device Pins is defined as positive. Current out of a device Pin is defined as negative. Voltages are referenced to ground except VOD, ΔVOD, VTH and VTL which are differential voltages.
(5) When the Serializer output is at TRI-STATE the Deserializer will lose PLL lock. Resynchronization / Relock must occur before data transfer require tPLD
(6) tPLD and tDDLT is the time required by the serializer and deserializer to obtain lock when exiting power-down state with an active clock.
(7) UI – Unit Interval is equivalent to one serialized data bit width (1UI = 1 / (28*CLK) ). The UI scales with clock frequency.
(8) tDPJ is the maximum amount the period is allowed to deviate over many samples.
(9) tDCCJ is the maximum amount of jitter between adjacent clock cycles.
(10) Supply noise testing was done with minimum capacitors on the PCB. A sinusoidal signal is AC coupled to the VDDn (1.8V) supply with amplitude = 100 mVp-p measured at the device VDDn Pins. Bit error rate testing of input to the Ser and output of the Des with 10 meter cable shows no error when the noise frequency on the Ser is less than 750 kHz. The Des on the other hand shows no error when the noise frequency is less than 400 kHz.
(11) Specification is ensured by characterization and is not tested in production.
(12) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

6.8 Recommended Timing For The Serial Control Bus

Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fSCL SCL Clock Frequency Standard Mode 100 kHz
Fast Mode 400 kHz
tLOW SCL Low Period Standard Mode 4.7 µs
Fast Mode 1.3 µs
tHIGH SCL High Period Standard Mode 4.0 µs
Fast Mode 0.6 µs
tHD;STA Hold time for a start or a repeated start condition,
Figure 18		 Standard Mode 4.0 µs
Fast Mode 0.6 µs
tSU:STA Set Up time for a start or a repeated start condition,
Figure 18		 Standard Mode 4.7 µs
Fast Mode 0.6 µs
tHD;DAT Data Hold Time,
Figure 18		 Standard Mode 0 3.45 µs
Fast Mode 0 0.9 µs
tSU;DAT Data Set Up Time,
Figure 18		 Standard Mode 250 ns
Fast Mode 100 ns
tSU;STO Set Up Time for STOP Condition, Figure 18 Standard Mode 4.0 µs
Fast Mode 0.6 µs
tBUF Bus Free Time
Between STOP and START, Figure 18		 Standard Mode 4.7 µs
Fast Mode 1.3 µs
tr SCL and SDA Rise Time,
Figure 18		 Standard Mode 1000 ns
Fast Mode 300 ns
tf SCL and SDA Fall Time,
Figure 18		 Standard Mode 300 ns
Fast mode 300 ns
30065346.gifFigure 1. Serializer Test Circuit
30065330.gifFigure 2. Serializer Output Waveforms
30065347.gifFigure 3. Serializer Output Transition Times
30065331.gifFigure 4. Serializer Input CLKIN Waveform And Set And Hold Times
30065348.gifFigure 5. Serializer Lock Time
30065349.gifFigure 6. Serializer Disable Time
30065310.gifFigure 7. Serializer Latency Delay
30065350.gifFigure 8. Serializer Output Jitter
30065332.gifFigure 9. Checkerboard Data Pattern
30065305.gifFigure 10. Deserializer LVCMOS Transition Times
30065311.gifFigure 11. Deserializer Delay – Latency
30065313.gifFigure 12. Deserializer Disable Time (OSS_SEL = 0)
30065314.gifFigure 13. Deserializer PLL Lock Times And PDB Tri-State Delay
30065335.gifFigure 14. Deserializer Output Data Valid (Setup And Hold) Times With SSCG = Off
30065334.gifFigure 15. Deserializer Output Data Valid (Setup And Hold) Times With SSCG = On
30065316.gifFigure 16. Receiver Input Jitter Tolerance
30065352.gifFigure 17. BIST Pass Waveform
30065336.gifFigure 18. Serial Control Bus Timing Diagram

6.9 Recommended Serializer Timing For CLKIN

Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tTCP Transmit Input CLKIN Period 5 MHz to 50 MHz, Figure 4 20 T 200 ns
tTCIH Transmit Input CLKIN High Time 0.4T 0.5T 0.6T ns
tTCIL Transmit Input CLKIN Low Time 0.4T 0.5T 0.6T ns
tCLKT CLKIN Input Transition Time 0.5 2.4 ns
SSCIN CLKIN Input – Spread Spectrum at 50 MHz fmod 35 kHz
fdev ±0.02
fMOD		 kHz

6.10 Serializer Switching Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tLHT Ser Output Low-to-High Transition Time, Figure 3 RL = 100Ω, De-emphasis = disabled,
VODSEL = 0		 200 ps
RL = 100Ω, De-emphasis = disabled,
VODSEL = 1		 200 ps
tHLT Ser Output High-to-Low Transition Time, Figure 3 RL = 100Ω, De-emphasis = disabled,
VODSEL = 0		 200 ps
RL = 100Ω, De-emphasis = disabled,
VODSEL = 1		 200 ps
tDIS Input Data - Setup Time,
Figure 4		 DI[23:0], CI1, CI2, CI3 to CLKIN 2 ns
tDIH Input Data - Hold Time,
Figure 4		 CLKIN to DI[23:0], CI1, CI2, CI3 2 ns
tXZD Ser Output Active to OFF Delay, Figure 6 8 15 ns
tPLD Serializer PLL Lock Time(5),
Figure 5		 RL = 100Ω 1.4 10 ms
tSD Serializer Delay - Latency, Figure 7 RL = 100Ω 144*T 145*T ns
tDJIT Ser Output Total Jitter,
Figure 8		 RL = 100Ω, De-Emph = disabled,
RANDOM pattern, CLKIN = 50 MHz		 0.28 UI
RL = 100Ω, De-Emph = disabled,
RANDOM pattern, CLKIN = 43MHz		 0.27 UI
RL = 100Ω, De-Emph = disabled,
RANDOM pattern, CLKIN = 5MHz		 0.35 UI
λSTXBW Serializer Jitter Transfer
Function -3 dB Bandwidth		 CLKIN = 50 MHz 3 MHz
CLKIN = 43 MHz 2.3 MHz
CLKIN = 20 MHz 1.3 MHz
CLKIN = 5MHz 650 kHz
δSTX Serializer Jitter Transfer
Function Peaking		 CLKIN = 50 MHz 0.84 dB
CLKIN = 43 MHz 0.83 dB
CLKIN = 20 MHz 0.83 dB
CLKIN = 5MHz 0.28 dB

6.11 Deserializer Switching Characteristics

Over recommended operating supply and temperature ranges unless otherwise specified.
PARAMETER TEST CONDITIONS PIN/FREQ. MIN TYP MAX UNIT
tRCP CLK Output Period tRCP = tTCP CLKOUT 20 T 200 ns
tRDC CLK Output Duty Cycle SSCG = OFF, 5 – 50MHz 0.43T 0.50T 0.57T ns
SSCG = ON, 5 – 20 MHz 0.35T 0.59T 0.65T ns
SSCG = ON, 20 – 50 MHz 0.40T 0.53T 0.60T ns
tCLH LVCMOS
Low-to-High
Transition Time, Figure 10		 VDDIO = 1.8V,
CL = 4pF, OS_CLKOUT/DATA = L		 CLKOUT/DO[23:0], CO1, CO2, CO3 2.1 ns
VDDIO = 3.3V
CL = 4pF, OS_CLKOUT/DATA = H		 2.0 ns
tCHL LVCMOS
High-to-Low
Transition Time, Figure 10		 VDDIO = 1.8V
CL = 4pF, OS_CLKOUT/DATA = L		 CLKOUT/DO[23:0], CO1, CO2, CO3 1.6 ns
VDDIO = 3.3V
CL = 8 pF, OS_CLKOUT/DATA = H		 1.5 ns
tROS Data Valid before CLKOUT – Set Up Time, Figure 14 VDDIO = 1.71 to 1.89V or VDDIO = 3.0 to 3.6V
CL = 4pF (lumped load)		 DO[23:0], CO1, CO2, CO3 0.27 0.45 T
tROH Data Valid after CLKOUT – Hold Time, Figure 14 VDDIO = 1.71 to 1.89V or VDDIO = 3.0 to 3.6V
CL = 4pF (lumped load)		 DO[23:0], CO1, CO2, CO3 0.4 0.55 T
tDDLT Deserializer Lock Time,
Figure 13		 SSC[3:0] = OFF,
See(6)		 CLKOUT = 5MHz 3 ms
SSC[3:0] = OFF,
See(6)		 CLKOUT = 50MHz 4 ms
SSC[3:0] = ON,
See(6)		 CLKOUT = 5MHz 30 ms
SSC[3:0] = ON,
See(6)		 CLKOUT = 50MHz 6 ms
tDD Des Delay - Latency, Figure 11 SSC[3:0] = ON,
See(9)		 CLKOUT = 5 to 50 MHz 139*T 140*T ns
tDPJ Des Period Jitter SSC[3:0] = OFF,
See(8)		 CLKOUT = 5MHz 975 1700 ps
CLKOUT = 10MHz 500 1000 ps
CLKOUT = 50MHz 550 1250 ps
tDCCJ Des Cycle-to-Cycle Jitter SSC[3:0] = OFF,
See(9)		 CLKOUT = 5MHz 675 1150 ps
CLKOUT = 10MHz 375 900 ps
CLKOUT = 50MHz 500 1150 ps
tIIT Des Input Jitter Tolerance, Figure 16 EQ = OFF,
SSCG = OFF,
CLKOUT = 50 MHz		 jitter freq <2MHz 0.9 UI(7)
jitter freq >6MHz 0.5 UI(7)
BIST MODE
tPASS BIST PASS Valid Time,
BISTEN = 1, Figure 17		 1 10 µs
SSCG MODE
fDEV Spread Spectrum
Clocking Deviation
Frequency		 Under typical conditions CLKOUT = 5 to 50 MHz,
SSC[3:0] = ON		 ±0.005 fMOD ±0.02 fMOD KHz
fMOD Spread Spectrum
Clocking Modulation
Frequency		 Under typical conditions CLKOUT = 5 to 50 MHz,
SSC[3:0] = ON		 8 100 kHz

6.12 Typical Characteristics

tc03_snls302.gif
Note: On the rising edge of each clock period, the CML driver outputs a low Stop bit, high Start bit, and 28 DC-scrambled data bits.
Figure 19. Serializer CML Driver Output with 50 MHz TX Pixel Clock.
tc04_snls302.gif
Note: When both devices are locked and the scope is triggered from the TX pixel clock, the RX clock is genlocked to the TX pixel clock and does not drift.
Figure 20. Comparison of Deserializer LVCMOS RX Clock Output locked to a 50 MHz TX Pixel Clock.