SNLS321C May   2010  – May 2016 DS92LV2421 , DS92LV2422

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Serializer DC
    6. 6.6  Electrical Characteristics - Deserializer DC
    7. 6.7  Electrical Characteristics - DC and AC Serial Control Bus
    8. 6.8  Timing Requirements - DC and AC Serial Control Bus
    9. 6.9  Timing Requirements - Serializer for CLKIN
    10. 6.10 Timing Requirements - Serial Control Bus
    11. 6.11 Switching Characteristics - Serializer
    12. 6.12 Switching Characteristics - Deserializer
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Data Transfer
      2. 7.3.2 Video Control Signal Filter - Serializer and Deserializer
      3. 7.3.3 Serializer Functional Description
        1. 7.3.3.1 EMI Reduction Features
          1. 7.3.3.1.1 Data Randomization and Scrambling
          2. 7.3.3.1.2 Serializer Spread Spectrum Compatibility
        2. 7.3.3.2 Signal Quality Enhancers
          1. 7.3.3.2.1 Serializer VOD Select (VODSEL)
          2. 7.3.3.2.2 Serializer De-Emphasis (De-Emph)
        3. 7.3.3.3 Power-Saving Features
          1. 7.3.3.3.1 Serializer Power-Down Feature (PDB)
          2. 7.3.3.3.2 Serializer Stop Clock Feature
          3. 7.3.3.3.3 1.8-V or 3.3-V VDDIO Operation
          4. 7.3.3.3.4 Deserializer Power-Down Feature (PDB)
          5. 7.3.3.3.5 Deserializer Stop Stream SLEEP Feature
        4. 7.3.3.4 Serializer Pixel Clock Edge Select (RFB)
        5. 7.3.3.5 Optional Serial Bus Control
        6. 7.3.3.6 Optional BIST Mode
      4. 7.3.4 Deserializer Functional Description
        1. 7.3.4.1  Signal Quality Enhancers
          1. 7.3.4.1.1 Deserializer Input Equalizer Gain (EQ)
        2. 7.3.4.2  EMI Reduction Features
          1. 7.3.4.2.1 Deserializer Output Slew Rate Select (OS_CLKOUT/OS_DATA)
          2. 7.3.4.2.2 Deserializer Common-Mode Filter Pin (CMF) (Optional)
          3. 7.3.4.2.3 Deserializer SSCG Generation (Optional)
          4. 7.3.4.2.4 1.8-V or 3.3-V VDDIO Operation
        3. 7.3.4.3  Deserializer Clock-Data Recovery Status Flag (LOCK) And Output State Select (OSS_SEL)
        4. 7.3.4.4  Deserializer Oscillator Output (Optional)
        5. 7.3.4.5  Deserializer OP_LOW (Optional)
        6. 7.3.4.6  Deserializer Clock Edge Select (RFB)
        7. 7.3.4.7  Deserializer Control Signal Filter (Optional)
        8. 7.3.4.8  Deserializer Low Frequency Optimization (LF_Mode)
        9. 7.3.4.9  Deserializer Map Select
        10. 7.3.4.10 Deserializer Strap Input Pins
        11. 7.3.4.11 Optional Serial Bus Control
        12. 7.3.4.12 Optional BIST Mode
      5. 7.3.5 Built-In Self Test (BIST)
        1. 7.3.5.1 Sample BIST Sequence
        2. 7.3.5.2 BER Calculations
      6. 7.3.6 Optional Serial Bus Control
    4. 7.4 Device Functional Modes
      1. 7.4.1 Serializer and Deserializer Operating Modes and Reverse Compatibility (CONFIG[1:0])
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Display Application
      2. 8.1.2 Live Link Insertion
      3. 8.1.3 Alternate Color / Data Mapping
    2. 8.2 Typical Applications
      1. 8.2.1 DS92LV2421 Typical Connection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 DS92LV2422 Typical Connection
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 WQFN (LLP) Stencil Guidelines
      2. 10.1.2 Transmission Media
      3. 10.1.3 LVDS Interconnect Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resource
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Development Support

For development support see the following:

LVDS Owner’s Manual, www.ti.com/lvds

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

  • Absolute Maximum Ratings for Soldering, SNOA549
  • Leadless Leadframe Package (LLP) Application Report, SNOA401
  • AN-1108 Channel-Link PCB and Interconnect Design-In Guidelines, SNLA008
  • AN-905 Transmission Line RAPIDESIGNER Operation and Applications Guide, SNLA035

11.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 21. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
DS92LV2421 Click here Click here Click here Click here Click here
DS92LV2422 Click here Click here Click here Click here Click here

11.4 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.