SLVSEE2A
February 2018 – April 2018
ESD204
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
Typical Application Schematic
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings -JEDEC Specifications
6.3
ESD Ratings - IEC Specifications
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Signal Range
8.2.2.2
Operating Frequency
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Examples
11
Device and Documentation Support
11.1
Receiving Notification of Documentation Updates
11.2
Community Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DQA|10
MPSS004C
Thermal pad, mechanical data (Package|Pins)
DQA|10
QFND791
Orderable Information
slvsee2a_oa
slvsee2a_pm
6.7
Typical Characteristics
Figure 1.
Positive TLP Curve, IO pin to GND (t
p
= 100 ns)
Figure 3.
Surge Curve (t
p
= 8/20 µs), any IO pin to GND
Figure 5.
–8-kV IEC 61000-4-2 Clamping Voltage Waveform, GND pin to IO
Figure 7.
Leakage Current vs Temperature, IO pin to GND at 3.6 V Bias
Figure 9.
Capacitance vs Frequency
Figure 2.
Negative TLP Curve, GND to IO pin (t
p
=100 ns; Plotted as Positive TLP Curve from GND to IO pin)
Figure 4.
8-kV IEC 61000-4-2 Clamping Voltage Waveform, IO pin to GND
Figure 6.
Capacitance vs Bias Voltage
Figure 8.
DC Voltage Sweep I-V Curve, IO pin to GND
Figure 10.
Differential Insertion Loss