SLVSEN8B July   2018  – October 2023 ESD321

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings – JEDEC Specifications
    3. 6.3 ESD Ratings – IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range
        2. 8.2.2.2 Operating Frequency
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Typical Characteristics

GUID-7926C9AF-7ED4-417B-B843-CAE6ED9AE19F-low.gifFigure 6-1 TLP I-V Curve, I/O Pin to GND (tp = 100 ns)
GUID-E6C0CCB7-27C3-499B-92C8-7CCFB615B3DC-low.gifFigure 6-3 8-kV IEC 61000-4-2 Clamping Voltage Waveform, I/O Pin to GND
GUID-83036DDA-5F1D-4F19-8E2C-EDD35BA57C80-low.gifFigure 6-5 DC Voltage Sweep I-V Curve, I/O Pin to GND
GUID-D453FEF1-023D-4E13-82BF-D04BBF17746E-low.gifFigure 6-7 Capacitance vs. Bias Voltage For Different Temperatures (°C)
GUID-52D07619-21D1-437A-9D43-1BD5E3D9EC0F-low.gifFigure 6-9 Insertion Loss vs. Frequency
GUID-4B4E7F00-2C83-4677-AB16-2F026E4B1AC8-low.gifFigure 6-2 TLP I-V Curve, GND to I/O Pin (tp = 100 ns)
GUID-0C8CB4E8-6636-439D-96EB-7AA1CEFEE9AD-low.gifFigure 6-4 8-kV IEC 61000-4-2 Clamping Voltage Waveform, GND to I/O Pin
GUID-20230725-SS0I-FNTV-WNDJ-BKWVZHZPM5GN-low.svgFigure 6-6 Surge Curve (IEC 61000-4-5, tp=8/20 µs), I/O Pin to GND
GUID-04F24E71-2492-4421-BF4C-72CCE1EB7733-low.gifFigure 6-8 Leakage Current (at 3.6 V Bias) Across Temperature, I/O Pin to GND