SLVSEO3
July 2018
ESD351
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Typical USB 2.0 Application Schematic
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings -JEDEC Specifications
6.3
ESD Ratings - IEC Specifications
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Signal Range
8.2.2.2
Operating Frequency
8.2.3
Application Curve
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DPY|2
MPSS034D
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slvseo3_oa
slvseo3_pm
1
Features
IEC 61000-4-2 Level 4 ESD Protection
±30-kV Contact Discharge
±30-kV Air Gap Discharge
IEC 61000-4-4 EFT Protection
80 A (5/50 ns)
IEC 61000-4-5 Surge Protection
6 A (8/20 µs)
IO Capacitance: 1.8 pF (Typical)
DC Breakdown Voltage: 4.5 V (Minimum)
Low Leakage Current: 0.1 nA (Typical)
Extremely Low ESD Clamping Voltage
6.5 V at 16-A TLP (I/O Pin to GND)
R
DYN
: 0.1 Ω (I/O Pin to GND)
Industrial Temperature Range: –40°C to +125°C
Industry Standard 0402 Package (DFN1006P2)