SLVSH27A april   2023  – june 2023 ESD451

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPL|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • IEC 61000-4-2 level 4 ESD protection:
    • ±30 kV contact discharge
    • ±30 kV air gap discharge
  • IEC 61000-4-5 surge protection:
    • 6.2 A (8/20 µs)
  • IO capacitance:
    • 0.5 pF (typical)
  • DC breakdown voltage: ±8 V (typical)
  • Ultra low leakage current: 50 nA (maximum)
  • Extremely low ESD clamping voltage
    • 10.4 V at 16 A TLP
    • RDYN: 0.19 Ω
  • Low insertion loss: 3.5 GHz (-3 dB bandwidth)
  • Supports high speed interfaces up to 7 Gbps
  • Industrial temperature range: –55°C to +150°C
  • Space-saving industry standard 0201 footprint
    (0.6 mm × 0.3 mm × 0.3 mm)