SLVSH27A april   2023  – june 2023 ESD451

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Pin Configuration and Functions
  7. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings—JEDEC Specification
    3. 6.3 ESD Ratings—IEC Specification
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  8. 7Application and Implementation
    1. 7.1 Application Information
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPL|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Typical Characteristics

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Figure 6-1 Positive TLP Curve
GUID-20230524-SS0I-6SMZ-M3NC-ZQMTMZSNLC57-low.svg
 
Figure 6-3 +8-kV Clamped IEC Waveform
GUID-20230524-SS0I-JK7L-SPCP-KS6Q02HZPM1M-low.svg
 
Figure 6-5 Bias Voltage vs. Capacitance
GUID-20230524-SS0I-04FC-QB1B-QM74Q6FJZXJL-low.svgFigure 6-7 Temperature vs. Leakage Current
GUID-20230524-SS0I-VDXF-J1RT-QMTJRMKDZ0JL-low.svg
 
Figure 6-2 Negative TLP Curve
GUID-20230524-SS0I-7HJH-TWZG-63NBM07BTXL7-low.svg
 
Figure 6-4 -8-kV Clamped IEC Waveform
GUID-20230524-SS0I-GV6B-0DNS-PWR05GPJB3T7-low.svg
 
Figure 6-6 Temperature vs. Capacitance
GUID-20230524-SS0I-KT3L-57HN-RNJGHT2PZCBB-low.svgFigure 6-8 Insertion Loss