SLVSI08 August 2024 ESD601-Q1
PRODUCTION DATA
- 1
- 1Features
- 2Applications
- 3Description
- 4Pin Configuration and Functions
- 5Specifications
- 6Application and Implementation
- 7Device and Documentation Support
- 8Revision History
- 9Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- DPY|2
Thermal pad, mechanical data (Package|Pins)
Orderable Information
5.8 Typical Characteristics
Figure 5-1 Bias Voltage vs. Capacitance
Figure 5-3 Positive TLP Curve
Figure 5-5 8/20 μs Surge Response
Figure 5-7 -8kV Clamped IEC Waveform
Figure 5-2 DC I-V Curve
Figure 5-4 Negative TLP Curve
Figure 5-6 +8kV Clamped IEC Waveform
Figure 5-8 Insertion Loss