SLVSHP4 February 2024 ESD652
PRODUCTION DATA
- 1
- 1Features
- 2Applications
- 3Description
- 4Pin Configuration and Functions
- 5Specifications
- 6Application and Implementation
- 7Device and Documentation Support
- 8Revision History
- 9Mechanical, Packaging, and Orderable Information
Package Options
Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
- DBZ|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information
5.7 Typical Characteristics
Figure 5-1 -8kV Clamped IEC Waveform
Figure 5-2 +8kV Clamped IEC Waveform
Figure 5-3 Capacitance vs. Bias Voltage
Figure 5-4 DC Voltage Sweep I-V Curve
Figure 5-5 Negative TLP Curve
Figure 5-6 Positive TLP Curve
Figure 5-7 8/20μs Surge Response
Figure 5-8 Leakage Current vs. Temperature