SLVSI66 October   2024 ESD701

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings -JEDEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Application and Implementation
    1. 6.1 Application Information
  8. 7 Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8 Receiving Notification of Documentation Updates
  10. 9 Support Resources
  11. 10Trademarks
  12. 11Electrostatic Discharge Caution
  13. 12Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Typical Characteristics

ESD701 Positive TLP CurveFigure 5-1 Positive TLP Curve
ESD701 Bias Voltage vs. CapacitanceFigure 5-3 Bias Voltage vs. Capacitance
ESD701 8/20 μs Surge ResponseFigure 5-5 8/20 μs Surge Response
ESD701 Negative TLP CurveFigure 5-2 Negative TLP Curve
ESD701 DC-IV CurveFigure 5-4 DC-IV Curve