SLVSI66 October   2024 ESD701

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings -JEDEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Application and Implementation
    1. 6.1 Application Information
  8. 7 Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8 Receiving Notification of Documentation Updates
  10. 9 Support Resources
  11. 10Trademarks
  12. 11Electrostatic Discharge Caution
  13. 12Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC (1) ESD701 UNIT
DPY (X1SON)
2 PINS
RθJA Junction-to-ambient thermal resistance 262.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 132.3 °C/W
RθJB Junction-to-board thermal resistance 78.5 °C/W
ΨJT Junction-to-top characterization parameter 2.2 °C/W
ΨJB Junction-to-board characterization parameter 78.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.