SLVSH15 November   2023 ESD852 , ESD862

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics – ESD852
    8. 5.8 Typical Characteristics – ESD862
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information

THERMAL METRIC(1) ESD852 ESD862 UNIT

DBZ (SOT-23)

 DBZ (SOT-23)
3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance

293.4

 313.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance

148.9

 162.8 °C/W
RθJB Junction-to-board thermal resistance

133.0

151.8

 °C/W
ΨJT Junction-to-top characterization parameter

32.9

43.5

 °C/W
ΨJB Junction-to-board characterization parameter

132.0

 150.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.