SLVSEG8B May   2018  – January 2024 ESDS302 , ESDS304

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - JEDEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Signal Range
        2. 7.2.2.2 Operating Frequency
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • IEC 61000-4-2 level 4 ESD protection:
    • ±30kV contact discharge
    • ±30kV air gap discharge
  • IEC 61000-4-4 EFT protection:
    • 80 A (5/50ns)
  • IEC 61000-4-5 surge protection:
    • 12A (8/20μs)
    • Low surge clamping voltage 6V at 12A Ipp
  • IO capacitance:
    • 2.3pF (typical)
  • DC breakdown voltage: 4.5V (minimum)
  • Ultra low leakage current: 3nA (typical)
  • Supports high speed interfaces up to 1 Gbps
  • Industrial temperature range: –40°C to +125°C
  • Easy flow-through routing package (ESDS302)