SLVSHJ6A December   2023  – February 2024 ESDS552

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - JEDEC Specifications
    3. 5.3 ESD Ratings - IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20230826-SS0I-1NZK-DWC6-9KVGNGQGCHHH-low.svgFigure 4-1 ESDS552 DBZ Package,3-Pin SOT-23(Top View)
Table 4-1 Pin Functions for ESDS552
PIN TYPE(1) DESCRIPTION
NAME NO.
IO 1, 2 I/O Surge and ESD protected IO
GND 3 GND Ground. Connect to ground
(1) I = Input, O = Output, I/O = Input or Output, GND = ground