SNOSCZ4A April   2015  – October 2024 FDC1004-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Voltage Level
    7. 5.7 I2C Interface Timing
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 The Shield
      2. 6.3.2 The CAPDAC
      3. 6.3.3 Capacitive System Offset Calibration
      4. 6.3.4 Capacitive Gain Calibration
    4. 6.4 Device Functional Modes
      1. 6.4.1 Single Ended Measurement
      2. 6.4.2 Differential Measurement
    5. 6.5 Programming
      1. 6.5.1 Serial Bus Address
      2. 6.5.2 Read/Write Operations
      3. 6.5.3 Device Usage
        1. 6.5.3.1 Measurement Configuration
        2. 6.5.3.2 Triggering Measurements
        3. 6.5.3.3 Wait for Measurement Completion
        4. 6.5.3.4 Read of Measurement Result
    6. 6.6 Register Maps
      1. 6.6.1 Registers
        1. 6.6.1.1 Capacitive Measurement Registers
      2. 6.6.2 Measurement Registers
      3. 6.6.3 Measurement Configuration Registers
      4. 6.6.4 FDC Configuration Register
      5. 6.6.5 Offset Calibration Registers
      6. 6.6.6 Gain Calibration Registers
      7. 6.6.7 Manufacturer ID Register
      8. 6.6.8 Device ID Register
  8. 7 Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Liquid Level Sensor
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Initialization Set Up
    5. 7.5 Power Supply Recommendations
    6. 7.6 Layout
      1. 7.6.1 Layout Guidelines
      2. 7.6.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)FDC1004-Q1UNIT
VSSOP (DGS)
10 PINS
RθJAJunction-to-ambient thermal resistance46.8°C/W
RθJCJunction-to-case(top) thermal resistance48.7°C/W
RθJBJunction-to-board thermal resistance70.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.