SNOSCZ9 May 2016 FDC2112-Q1 , FDC2114-Q1 , FDC2212-Q1 , FDC2214-Q1
PRODUCTION DATA.
For related links, see the following:
Texas Instruments' WEBENCH® tool: http://www.ti.com/webench
For related documentation, refer to the following:
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953)
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.
PARTS | PRODUCT FOLDER | SAMPLE & BUY | TECHNICAL DOCUMENTS | TOOLS & SOFTWARE | SUPPORT & COMMUNITY |
---|---|---|---|---|---|
FDC2112-Q1 | Click here | Click here | Click here | Click here | Click here |
FDC2114-Q1 | Click here | Click here | Click here | Click here | Click here |
FDC2212-Q1 | Click here | Click here | Click here | Click here | Click here |
FDC2214-Q1 | Click here | Click here | Click here | Click here | Click here |
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All other trademarks are the property of their respective owners.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.