SNOSCZ9A May   2016  – October 2024 FDC2112-Q1 , FDC2114-Q1 , FDC2212-Q1 , FDC2214-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics - I2C
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Clocking Architecture
      2. 6.3.2 Multi-Channel and Single-Channel Operation
      3. 6.3.3 Current Drive Control Registers
      4. 6.3.4 Device Status Registers
      5. 6.3.5 Input Deglitch Filter
    4. 6.4 Device Functional Modes
      1. 6.4.1 Start-Up Mode
      2. 6.4.2 Normal (Conversion) Mode
      3. 6.4.3 Sleep Mode
      4. 6.4.4 Shutdown Mode
        1. 6.4.4.1 Reset
    5. 6.5 Programming
      1. 6.5.1 I2C Interface Specifications
    6. 6.6 Register Maps
      1. 6.6.1  Register List
      2. 6.6.2  Address 0x00, DATA_CH0
      3. 6.6.3  Address 0x01, DATA_LSB_CH0 (FDC2212 / FDC2214 only)
      4. 6.6.4  Address 0x02, DATA_CH1
      5. 6.6.5  Address 0x03, DATA_LSB_CH1 (FDC2212 / FDC2214 only)
      6. 6.6.6  Address 0x04, DATA_CH2 (FDC2114, FDC2214 only)
      7. 6.6.7  Address 0x05, DATA_LSB_CH2 (FDC2214 only)
      8. 6.6.8  Address 0x06, DATA_CH3 (FDC2114, FDC2214 only)
      9. 6.6.9  Address 0x07, DATA_LSB_CH3 (FDC2214 only)
      10. 6.6.10 Address 0x08, RCOUNT_CH0
      11. 6.6.11 Address 0x09, RCOUNT_CH1
      12. 6.6.12 Address 0x0A, RCOUNT_CH2 (FDC2114, FDC2214 only)
      13. 6.6.13 Address 0x0B, RCOUNT_CH3 (FDC2114, FDC2214 only)
      14. 6.6.14 Address 0x0C, OFFSET_CH0 (FDC21112 / FDC2114 only)
      15. 6.6.15 Address 0x0D, OFFSET_CH1 (FDC21112 / FDC2114 only)
      16. 6.6.16 Address 0x0E, OFFSET_CH2 (FDC2114 only)
      17. 6.6.17 Address 0x0F, OFFSET_CH3 (FDC2114 only)
      18. 6.6.18 Address 0x10, SETTLECOUNT_CH0
      19. 6.6.19 Address 0x11, SETTLECOUNT_CH1
      20. 6.6.20 Address 0x12, SETTLECOUNT_CH2 (FDC2114, FDC2214 only)
      21. 6.6.21 Address 0x13, SETTLECOUNT_CH3 (FDC2114, FDC2214 only)
      22. 6.6.22 Address 0x14, CLOCK_DIVIDERS_CH0
      23. 6.6.23 Address 0x15, CLOCK_DIVIDERS_CH1
      24. 6.6.24 Address 0x16, CLOCK_DIVIDERS_CH2 (FDC2114, FDC2214 only)
      25. 6.6.25 Address 0x17, CLOCK_DIVIDERS_CH3 (FDC2114, FDC2214 only)
      26. 6.6.26 Address 0x18, STATUS
      27. 6.6.27 Address 0x19, ERROR_CONFIG
      28. 6.6.28 Address 0x1A, CONFIG
      29. 6.6.29 Address 0x1B, MUX_CONFIG
      30. 6.6.30 Address 0x1C, RESET_DEV
      31. 6.6.31 Address 0x1E, DRIVE_CURRENT_CH0
      32. 6.6.32 Address 0x1F, DRIVE_CURRENT_CH1
      33. 6.6.33 Address 0x20, DRIVE_CURRENT_CH2 (FDC2114 / FDC2214 only)
      34. 6.6.34 Address 0x21, DRIVE_CURRENT_CH3 (FDC2114 / FDC2214 only)
      35. 6.6.35 Address 0x7E, MANUFACTURER_ID
      36. 6.6.36 Address 0x7F, DEVICE_ID
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Sensor Configuration
      2. 7.1.2 Shield
      3. 7.1.3 Power-Cycled Applications
      4. 7.1.4 Inductor Self-Resonant Frequency
      5. 7.1.5 Application Curves for Proximity Sensing
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Recommended Initial Register Configuration Values
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Examples
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Address 0x19, ERROR_CONFIG

Figure 6-34 Address 0x19, ERROR_CONFIG
15141312111098
RESERVEDWD_ ERR2OUTAH_WARN2OUTAL_WARN2OUTRESERVED
76543210
RESERVEDWD_ERR2INTRESERVEDDRDY_2INT
Table 6-35 Address 0x19, ERROR_CONFIG
BitFieldTypeResetDescription
15:14RESERVEDR/W00Reserved (set to b000)
13WD_ ERR2OUTR/W0Watchdog Timeout Error to Output Register
b0: Do not report Watchdog Timeout errors in the DATA_CHx registers.
b1: Report Watchdog Timeout errors in the DATA_CHx.CHx_ERR_WD register field corresponding to the channel that generated the error.
12AH_WARN2OUTR/W0Amplitude High Warning to Output Register
b0:Do not report Amplitude High warnings in the DATA_CHx registers.
b1: Report Amplitude High warnings in the DATA_CHx.CHx_ERR_AW register field corresponding to the channel that generated the warning.
11AL_WARN2OUTR/W0Amplitude Low Warning to Output Register
b0: Do not report Amplitude Low warnings in the DATA_CHx registers.
b1: Report Amplitude High warnings in the DATA_CHx.CHx_ERR_AW register field corresponding to the channel that generated the warning.
10:6RESERVEDR/W0 0000Reserved (set to b0 0000)
5WD_ERR2INTR/W0Watchdog Timeout Error to INTB b0: Do not report Under-range errors by asserting INTB pin and STATUS register.
b1: Report Watchdog Timeout errors by asserting INTB pin and updating STATUS.ERR_WD register field.
4:1ReservedR/W0000Reserved (set to b000)
0DRDY_2INTR/W0Data Ready Flag to INTB b0: Do not report Data Ready Flag by asserting INTB pin and STATUS register.
b1: Report Data Ready Flag by asserting INTB pin and updating STATUS. DRDY register field.