SLLS206L May   2005  – August 2024 GD65232 , GD75232

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Recommended Operating Conditions
    3. 5.3  Thermal Information
    4. 5.4  Supply Currents over Recommended Operating Free-air Temperature Range
    5. 5.5  Electrical Characteristics, Driver
    6. 5.6  Switching Characteristics, Driver
    7. 5.7  Electrical Characteristics, Receiver
    8. 5.8  Switching Characteristics, Receiver
    9. 5.9  Typical Characteristics Driver
    10. 5.10 Typical Characteristics Receiver
  7. 6 Parameter Measurement Information
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Schematic
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) DB
(SSOP)		 DW
(SOIC)		 N
(PDIP)		 PW
(TSSOP)		 UNIT
20 PINS 20 PINS 20 PINS 20 PINS
R θJA Junction-to-ambient thermal resistance 92.0 73.0 59.8 97.5 °C/W
R θJC(top) Junction-to-case (top) thermal resistance 54.3 40.2 39.1 41.3 °C/W
R θJB Junction-to-board thermal resistance 57.0 45.7 36.1 59.2 °C/W
ψ JT Junction-to-top characterization parameter 14.7 12.8 18.3 4.1 °C/W
ψ JB Junction-to-board characterization parameter 56.3 45.0 35.7 58.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.