SLAS901C December   2016  – January 2021 HD3SS213

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 HD3SS213 AUX Channel in 2:1 Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 HD3SS213 AUX Channel in 1:2 Application
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Differential Traces
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (December 2016) to Revision C (January 2021)

  • NOTE: The device in the MicroStar Jr. BGA packaging were redesigned using a laminate nFBGA package. This nFBGA package offers datasheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar Jr. BGA. The new package designator in place of the discontinued package designator will be updated throughout the datasheet.Go
  • Changed u*jr BGA to nFBGAGo
  • Changed ZQE to ZXHGo
  • Changed u*jr ZQE to nFBGA ZXH. Updated thermal data.Go
  • Changed u*jr BGA to nFBGAGo

Changes from Revision A (September 2013) to Revision B (December 2016)

  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Added A2 to J4 row in Pin Functions tableGo

Changes from Revision * (September 2013) to Revision A (September 2013)

  • Deleted Ordering InformationGo