SLAS901C December   2016  – January 2021 HD3SS213

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 HD3SS213 AUX Channel in 2:1 Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 HD3SS213 AUX Channel in 1:2 Application
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Differential Traces
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1.2 Detailed Design Procedure

  • Connect VDD and GND pins to the power and ground planes of the printed-circuit board with 0.1-µF bypass capacitor
  • Use VDD/2 logic level at AUX_SEL pin
  • Use 3.3-V TTL/CMOS logic level at Dx_SEL to connect DAx to DCx
  • Use GND logic level at Dx_SEL to connect DBx to DCx
  • Use controlled-impedance transmission media for all the differential signals
  • Ensure the received complimentary signals are with a differential amplitude of <1800 mVPP and a common-mode voltage of <2 V