SLAS907C December   2015  – December 2020 HD3SS214

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings (1) (1)
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics, Device Parameters
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Speed Switching
      2. 7.3.2 HPD, AUX, and DDC Switching
      3. 7.3.3 Output Enable and Power Savings
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Dual GPU With Docking Station Support
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 DP Inputs
        2. 8.2.3.2 Source Selection Interface
      4. 8.2.4 DP++ Support
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1 AUX and DDC Switching
          2. 8.2.4.2.2 CONFIG1 and CONFIG2 Routing
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layer Stack
      2. 10.1.2 Differential Traces
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from , to , (from Revision B (June 2017) to Revision C (December 2020))

  • Changed Title and Feature From: DisplayPort 1.3 To: DisplayPort 1.4Go
  • NOTE: The device in the MicroStar Jr. BGA packaging were redesigned using a laminate nFBGA package. This nFBGA package offers datasheet-equivalent electrical performance. It is also footprint equivalent to the MicroStar Jr. BGA. The new package designator in place of the discontinued package designator will be updated throughout the datasheet.Go
  • Changed u*jr BGA to nFBGAGo
  • Changed u*jr ZQE to nFBGA ZXHGo
  • Changed DC2(p) to DC2(n) in Pin FunctionsGo
  • Changed DC2(n) to DC2(p) in Pin FunctionsGo
  • Changed u*jr ZQE to nFBGA ZXH. Updated thermal data.Go

Changes from Revision A (July 2016) to Revision B (June 2017)

  • Changed Title and Feature From: DisplayPort 1.3 To: DisplayPort 1.4Go

Changes from Revision * (December 2015) to Revision A (July 2016)

  • Changed DC2(p) to DC2(n) in Pin FunctionsGo
  • Changed DC2(n) to DC2(p) in Pin FunctionsGo