SLAS907C December 2015 – December 2020 HD3SS214
PRODUCTION DATA
THERMAL METRIC(1) | HD3SS214 | UNIT | |
---|---|---|---|
ZXH (nFBGA) | |||
50 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 72.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 35.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 43.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 42.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |