SLASE74F May 2015 – September 2016 HD3SS3212
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
On a high-K board, TI always recommends to solder the PowerPAD™ onto the thermal land. A thermal land is the area of solder-tinned-copper underneath the PowerPAD package. On a high-K board, the HD3SS3212 can operate over the full temperature range by soldering the PowerPAD onto the thermal land without vias.
On a low-K board, for the device to operate across the temperature range, the designer must use a 1-oz Cu trace connecting the GND pins to the thermal land. A general PCB design guide for PowerPAD packages is provided in PowerPAD Thermally-Enhanced Package, SLMA002.