SLASEB6 November   2015 HD3SS3411

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Enable and Power Savings
    4. 7.4 Device Functional Modes
  8. 8 Application Information and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
    4. 8.4 Detailed Design Procedure
      1. 8.4.1 AC Coupling Capacitors
    5. 8.5 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Critical Routes
      2. 10.1.2 General Routing/Placement Rules
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Supply voltage range (VCC) Absolute minimum/maximum supply voltage range –0.5 4 V
Voltage range Differential I/O –0.5 2.5 V
Control pin –0.5 VDD + 0.5
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 3 3.6 V
VIH Input high voltage (SEL, OEn Pin) 2 VCC V
VIL Input low voltage (SEL OEn Pin) –0.1 0.8 V
VDiff High speed signal pins differential voltage 0 1.8 VPP
VCM Common mode voltage (differential pins) 0 2 V
TA Operating free-air temperature –40 105 °C

6.4 Thermal Information

THERMAL METRIC(1) HD3SS3411 UNIT
RWA (WQFN)
14 PINS
RθJA Junction-to-ambient thermal resistance 50.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.1
RθJB Junction-to-board thermal resistance 26.4
ψJT Junction-to-top characterization parameter 2.2
ψJB Junction-to-board characterization parameter 26.5
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
ICC Device active Current VCC = 3.3 V, OEn = 0 0.6 0.8 mA
ISTDN Device shutdown Current VCC = 3.3 V, OEn = 0 0.3 0.6 µA
CON Outputs ON Capacitance 0.6 pF
RON Output ON resistance VCC = 3.3 V; VCM = 0 V to 2 V ;
IO = –8 mA		 5 8 Ω
ΔRON On resistance match between pairs of the same channel VCC = 3.3 V ; –0.35 V ≤ VIN ≤ 2.35 V;
IO = –8 mA		 0.5 Ω
R(FLAT_ON) On resistance flatness
(RON(MAX) – RON(MAIN)		 VDD = 3.3 V; –0.35 V ≤ VIN ≤ 2.35 V 1 Ω
IIH(CTRL) Input high current, control pins
(SEL, OEn)		 1 µA
IIL(CTRL) Input low current, control pins
(SEL, OEn)		 1 µA
IIH(HS) Input high current, high speed pins [A/B/C][p/n] VIN = 2 V for selected port, A and B with SEL= 0, and A and C with SEL = VCC 1 µA
[A/B/C][p/n] VIN = 2 V for non-selected port, C with SEL= 0, and B with
SEL = VCC
(Note there is a 20 KΩ pull-down in non-selected port)		 100 140 µA
IIL(HS) Input low current, high speed pins [A/B/C][p/n] 1 µA
High Speed Performance
IL Differential Insertion Loss f = 0.3 MHz –0.5 dB
f = 2.5 GHz –0.7
f = 4 GHz –1.1
BW -3 dB Bandwidth 7.5 GHz
RL Differential return loss f = 0.3 MHz –26.4 dB
f = 2.5 GHz –16.6
f = 4 GHz –11.3
OI Differential OFF isolation f = 0.3 MHz –75 dB
f = 2.5 GHz –22
f = 4 GHz –19
Xtalk Differential Crosstalk f = 4 GHz –35 dB

6.6 Timing Requirements

MIN NOM MAX UNIT
tPD Switch propagation delay 80 ps
tSW Switching time 0.5 ns
tSK_INTRA Intra-pair output skew 5 ps

6.7 Typical Characteristics

HD3SS3411 D001_SLASE82.gif
Figure 1. Return Loss vs Frequency
HD3SS3411 D002_SLASE82.gif
Figure 2. Insertion Loss vs Frequency