SNAS649B October   2014  – December 2015 HDC1008

PRODUCTION DATA.  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Typical Application
5. 5 Revision History
6. 6 Pin Configuration and Functions
7. 7 Specifications
   1. 7.1 Absolute Maximum Ratings
   2. 7.2 ESD Ratings
   3. 7.3 Recommended Operating Conditions
   4. 7.4 Thermal Information
   5. 7.5 Electrical Characteristics
   6. 7.6 I2C Interface Electrical Characteristics
   7. 7.7 I2C Interface Timing Requirements
   8. 7.8 Typical Characteristics
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Power Consumption
      2. 8.3.2 Voltage Supply Monitoring
      3. 8.3.3 Heater
   4. 8.4 Device Functional Modes
   5. 8.5 Programming
      1. 8.5.1 I2C Serial Bus Address Configuration
      2. 8.5.2 I2C Interface
         1. 8.5.2.1 Serial Bus Address
         2. 8.5.2.2 Read and Write Operations
         3. 8.5.2.3 Device Measurement Configuration
   6. 8.6 Register Map
      1. 8.6.1 Temperature Register
      2. 8.6.2 Humidity Register
      3. 8.6.3 Configuration Register
      4. 8.6.4 Serial Number Registers
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
   3. 9.3 Do's and Don'ts
      1. 9.3.1 Soldering
      2. 9.3.2 Hydration Procedure
      3. 9.3.3 Chemical Exposure
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Surface Mount
       2. 11.1.2 Stencil Printing Process
    2. 11.2 Layout Example
12. 12Device and Documentation Support
    1. 12.1 Documentation Support
       1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
13. 13Mechanical, Packaging, and Orderable Information