SNAS672A November   2015  – January 2016 HDC1080

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Electrical Characteristics
    7. 6.7 I2C Interface Timing Requirements
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Consumption
      2. 7.3.2 Voltage Supply Monitoring
      3. 7.3.3 Heater
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 Serial Bus Address
        2. 7.5.1.2 Read and Write Operations
        3. 7.5.1.3 Device Measurement Configuration
    6. 7.6 Register Map
      1. 7.6.1 Temperature Register
      2. 7.6.2 Humidity Register
      3. 7.6.3 Configuration Register
      4. 7.6.4 Serial Number Registers
      5. 7.6.5 Manufacturer ID Register
      6. 7.6.6 Device Register ID
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Implementation and Usage Recommendations
      1. 8.3.1 Soldering
      2. 8.3.2 Chemical Exposure and Sensor Protection
      3. 8.3.3 High Temperature and Humidity Exposure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Input Voltage VDD -0.3 6 V
SCL -0.3 6
SDA -0.3 6
Storage Temperature TSTG -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Supply Voltage 2.7 3 5.5 V
TA, Temperature sensor Ambient Operating Temperature -40 125 °C
TA, Humidity sensor(1) Ambient Operating Temperature -20 70 °C
TA, Humidity sensor(1) Functional Operating Temperature -20 85 °C
(1) See Figure 2.

6.4 Thermal Information

THERMAL METRIC(1) HDC1080 UNIT
PWSON (DMB)
6 PINS
RθJA Junction-to-ambient thermal resistance 49.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.8 °C/W
RθJB Junction-to-board thermal resistance 23.1 °C/W
ψJT Junction-to-top characterization parameter 3.3 °C/W
ψJB Junction-to-board characterization parameter 23.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics(1)

The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA = 30°C, RH = 40%, and VDD = 3V.
PARAMETER TEST CONDITION(2) MIN(3) TYP(4) MAX(3) UNIT
POWER CONSUMPTION
IDD Supply Current RH measurement, bit 12 of 0x02 register = 0(10) 190 220 µA
Temperature measurement, bit 12 of 0x02 register = 0(10) 160 185 µA
Sleep Mode 100 200 nA
Average @ 1 measurement/second, RH (11 bit), bit 12 of 0x02 register = 0(10)(11) 710 nA
Average @ 1 measurement/second, Temp (11 bit), bit 12 of 0x02 register = 0(10)(11) 590 nA
Average @ 1 measurement/second, RH (11bit) +temperature (11 bit), bit 12 of 0x02 register = 1(10)(11) 1.3 µA
Startup (average on Start-up time) 300 µA
IHEAT Heater Current(5) Peak current 7.2 mA
Average @ 1 measurement/second, RH (11bit) +temperature (11 bit), bit 12 of 0x02 register = 1(10)(11) 50 µA
RELATIVE HUMIDITY SENSOR
RHACC Accuracy Refer to Figure 2 in Typical Characteristics section. ±2 %RH
RHREP Repeatability(5) 14 bit resolution ±0.1 %RH
RHHYS Hysteresis (7) 10% ≤ RH ≤ 70% ±1 %RH
RHRT Response Time(9) t 63% (8) 15 s
RHCT Conversion Time(5) 8 bit resolution 2.50 ms
11 bit resolution 3.85 ms
14 bit resolution 6.50 ms
RHOR Operating Range(6) Non-condensing 0 100 %RH
RHLTD Long Term Drift(12) ±0.25 %RH/yr
TEMPERATURE SENSOR
TEMPACC Accuracy(5) 5°C < TA< 60°C ±0.2 ±0.4 °C
TEMPREP Repeatability(5) 14 bit resolution ±0.1 °C
TEMPCT Conversion Time(5) 11 bit accuracy 3.65 ms
14 bit accuracy 6.35 ms
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
(2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal values have no prefix.
(3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.
(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
(5) This parameter is specified by design and/or characterization and it is not tested in production.
(6) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement offset. The measurement offset will decrease after operating the sensor in this recommended operating range.
(7) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.
(8) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.
(9) Actual response times will vary dependent on system thermal mass and air-flow.
(10) I2C read/write communication and pull-up resistors current through SCL and SDA not included.
(11) Average current consumption while conversion is in progress.
(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, out-gassing tapes, adhesives, packaging materials, etc.

6.6 I2C Interface Electrical Characteristics

At TA=30°C, VDD=3V (unless otherwise noted)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
I2C INTERFACE VOLTAGE LEVEL
VIH Input High Voltage 0.7xVDD V
VIL Input Low Voltage 0.3xVDD V
VOL Output Low Voltage Sink current 3mA 0.4 V
HYS Hysteresis (1) 0.1xVDD V
CIN Input Capacitance on all digital pins 0.5 pF
(1) This parameter is specified by design and/or characterization and it is not tested in production.

6.7 I2C Interface Timing Requirements

PARAMETER TEST CONDITION MIN NOM MAX UNIT
I2C INTERFACE VOLTAGE LEVEL
fSCL Clock Frequency 10 400 kHz
tLOW Clock Low Time 1.3 µs
tHIGH Clock High Time 0.6 µs
tSP Pulse width of spikes that must be suppressed by the input filter (1) 50 ns
tSTART Device Start-up time From VDD ≥ 2.7 V to ready for a conversion(1)(2) 10 15 ms
(1) This parameter is specified by design and/or characterization and it is not tested in production.
(2) Within this interval it is not possible to communicate to the device.
HDC1080 REDUCED_TIMING_FINAL.gif Figure 1. I2C Timing

6.8 Typical Characteristics

Unless otherwise noted. TA = 30°C, VDD = 3V.
HDC1080 D001_SNAS672.gif
Figure 2. RH Accuracy vs. RH
HDC1080 D022_SNAS643.gif
Figure 4. Supply Current vs. Supply Voltage, RH Measurement Active
HDC1080 D023_SNAS643.gif
Figure 6. Supply Current vs. Supply Voltage, Temp Measurement Active
HDC1080 D024_SNAS643.gif
Figure 8. Supply Current vs. Supply Voltage, Sleep Mode
HDC1080 D028_SNAS643.gif
Figure 3. Temperature Accuracy vs. Temperature
HDC1080 D025_SNAS643.gif
Figure 5. Supply Current vs. Temperature, RH Measurement Active
HDC1080 D026_SNAS643.gif
Figure 7. Supply Current vs. Temperature, Temp Measurement Active
HDC1080 D027_SNAS643.gif
Figure 9. Supply Current vs. Temperature, Sleep Mode