SNAS693D July   2017  – February 2021 HDC2010

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 I2C Interface Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sleep Mode Power Consumption
      2. 7.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement
      3. 7.3.3 Heater
      4. 7.3.4 Interrupt Description
        1. 7.3.4.1 DRDY
      5. 7.3.5 INTERRUPT on Threshold
        1. 7.3.5.1 Temperature High
        2. 7.3.5.2 Temperature Low
        3. 7.3.5.3 Humidity High
        4. 7.3.5.4 Humidity Low
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode vs. Measurement Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Bus Address Configuration
      2. 7.5.2 I2C Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Read and Write Operations
    6. 7.6 Register Maps
      1. 7.6.1  Address 0x00 Temperature LSB
      2. 7.6.2  Address 0x01 Temperature MSB
      3. 7.6.3  Address 0x02 Humidity LSB
      4. 7.6.4  Address 0x03 Humidity MSB
      5. 7.6.5  Address 0x04 Interrupt DRDY
      6. 7.6.6  Address 0x05 Temperature MAX
      7. 7.6.7  Address 0x06 Humidity MAX
      8. 7.6.8  Address 0x07 Interrupt Configuration
      9. 7.6.9  Address 0x08 Temperature Offset Adjustment
      10. 7.6.10 47
      11. 7.6.11 Address 0x09 Humidity Offset Adjustment
      12. 7.6.12 49
      13. 7.6.13 Address 0x0A Temperature Threshold LOW
      14. 7.6.14 Address 0x0B Temperature Threshold HIGH
      15. 7.6.15 Address 0x0C Humidity Threshold LOW
      16. 7.6.16 Address 0x0D Humidity Threshold HIGH
      17. 7.6.17 Address 0x0E Reset and DRDY/INT Configuration Register
      18. 7.6.18 Address 0x0F Measurement Configuration
      19. 7.6.19 Manufacturer ID Low
      20. 7.6.20 Manufacturer ID High
      21. 7.6.21 Device ID Low
      22. 7.6.22 Device ID High
  9. 8  Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Guidelines for HDC2010 Storage and PCB Assembly
        1. 10.1.1.1 Storage and Handling
        2. 10.1.1.2 Soldering Reflow
        3. 10.1.1.3 Rework
        4. 10.1.1.4 High Temperature and Humidity Exposure
        5. 10.1.1.5 Bake/Re-Hydration Procedure
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YPA|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (May 2019) to Revision D (February 2021)

  • Removed GND pin absolute maximum ratingGo
  • Added DRDY/INT pin absolute maximum ratingGo
  • Added information from multiple table footnotes to Recommended Operating Conditions tableGo
  • Changed temperature accuracy maximum for 5℃ < TA < 60℃ Go
  • Added a narrower temperature range for tighter temperature accuracy maximum Go
  • Added TEMPPSRR parameterGo
  • Added content to the Heater sectionGo
  • Changed reference material in the Storage and Handling sectionGo
  • Removed DAP (Die Attached Pad) information from the Layout Example sectionGo

Changes from Revision B (August 2018) to Revision C (May 2019)

  • Changed description of behavior of TH_STATUS bit when INT_MODE is set to 1Go
  • Changed description of behavior of TH_STATUS bit when INT_MODE is set to 0Go
  • Changed description of behavior of TL_STATUS bit when INT_MODE is set to 1Go
  • Changed description of behavior of TL_STATUS bit when INT_MODE is set to 0Go
  • Changed description of behavior of HH_STATUS bit when INT_MODE is set to 1Go
  • Changed description of behavior of HH_STATUS bit when INT_MODE is set to 0Go
  • Changed description of behavior of HL_STATUS bit when INT_MODE is set to 1Go
  • Changed description of behavior of HL_STATUS bit when INT_MODE is set to 0Go
  • Changed the units for Humidity threshold low from: °C to: %RHGo
  • Changed the temperature resolution decoding from: 8 bit to: 9 bitGo
  • Changed the humidity resolution decoding from: 8 bit to: 9 bit Go
  • Changed the measurement configuration "10" bit encoding from: Humidity Only to: NA for field MEAS_CONFIG[1:0]Go

Changes from Revision A (March 2018) to Revision B (August 2018)

  • Changed the HDC2010 Detailed Description section, Application and Implementation section, Power Supply Recommendations section, and Layout section to align with the HDC2010 data sheetGo

Changes from Revision * (July 2017) to Revision A (March 2018)

  • Changed Features bullet from: Automatic Sampling Rate to: Programmable Sampling RateGo
  • Changed Features bullet from: On Demand to: Trigger On DemandGo
  • Changed HL_MASK to HL_ENABLE in Humidity Low Go