SNAS693D July   2017  – February 2021 HDC2010

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 I2C Interface Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sleep Mode Power Consumption
      2. 7.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement
      3. 7.3.3 Heater
      4. 7.3.4 Interrupt Description
        1. 7.3.4.1 DRDY
      5. 7.3.5 INTERRUPT on Threshold
        1. 7.3.5.1 Temperature High
        2. 7.3.5.2 Temperature Low
        3. 7.3.5.3 Humidity High
        4. 7.3.5.4 Humidity Low
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode vs. Measurement Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Bus Address Configuration
      2. 7.5.2 I2C Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Read and Write Operations
    6. 7.6 Register Maps
      1. 7.6.1  Address 0x00 Temperature LSB
      2. 7.6.2  Address 0x01 Temperature MSB
      3. 7.6.3  Address 0x02 Humidity LSB
      4. 7.6.4  Address 0x03 Humidity MSB
      5. 7.6.5  Address 0x04 Interrupt DRDY
      6. 7.6.6  Address 0x05 Temperature MAX
      7. 7.6.7  Address 0x06 Humidity MAX
      8. 7.6.8  Address 0x07 Interrupt Configuration
      9. 7.6.9  Address 0x08 Temperature Offset Adjustment
      10. 7.6.10 47
      11. 7.6.11 Address 0x09 Humidity Offset Adjustment
      12. 7.6.12 49
      13. 7.6.13 Address 0x0A Temperature Threshold LOW
      14. 7.6.14 Address 0x0B Temperature Threshold HIGH
      15. 7.6.15 Address 0x0C Humidity Threshold LOW
      16. 7.6.16 Address 0x0D Humidity Threshold HIGH
      17. 7.6.17 Address 0x0E Reset and DRDY/INT Configuration Register
      18. 7.6.18 Address 0x0F Measurement Configuration
      19. 7.6.19 Manufacturer ID Low
      20. 7.6.20 Manufacturer ID High
      21. 7.6.21 Device ID Low
      22. 7.6.22 Device ID High
  9. 8  Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Guidelines for HDC2010 Storage and PCB Assembly
        1. 10.1.1.1 Storage and Handling
        2. 10.1.1.2 Soldering Reflow
        3. 10.1.1.3 Rework
        4. 10.1.1.4 High Temperature and Humidity Exposure
        5. 10.1.1.5 Bake/Re-Hydration Procedure
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YPA|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The HDC2010 is an integrated humidity and temperature sensor that provides high accuracy measurements with very low power consumption, in an ultra-compact WLCSP (Wafer Level Chip Scale Package). The sensing element of the HDC2010 is placed on the bottom part of the device, which makes the HDC2010 more robust against dirt, dust, and other environmental contaminants. The capacitive-based sensor includes new integrated digital features and a heating element to dissipate condensation and moisture. The HDC2010 digital features include programmable interrupt thresholds to provide alerts/system wake-ups without requiring a microcontroller to be continuously monitoring the system. This, combined with programmable sampling intervals, low inherent power consumption, and support for 1.8-V supply voltage, make the HDC2010 well suited for battery-operated systems.

The HDC2010 provides high accuracy measurement capability for a wide range of environmental monitoring applications and Internet of Things (IoT) such as smart thermostats, smart home assistants and wearables. The HDC2010 can also be used to provide critical temperature and humidity data for cold chain transportation and storage of perishable goods to help ensure products like food and pharmaceuticals arrive fresh.

The HDC2010 is factory-calibrated to 0.2°C temperature accuracy and 2% relative humidity accuracy and includes a heating element to burn away condensation and moisture for increased reliability. The HDC2010 supports operation from –40°C to 125°C and from 0% to 100% relative humidity.

Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
HDC2010 DSBGA (6-bump) 1.5 mm × 1.5 mm × 0.675 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
HDC2010 Typical ApplicationTypical Application
HDC2010 RH AccuracyRH Accuracy