SNAS693D July   2017  – February 2021 HDC2010

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 I2C Interface Electrical Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Sleep Mode Power Consumption
      2. 7.3.2 Measurement Modes: Trigger on Demand vs. Auto Measurement
      3. 7.3.3 Heater
      4. 7.3.4 Interrupt Description
        1. 7.3.4.1 DRDY
      5. 7.3.5 INTERRUPT on Threshold
        1. 7.3.5.1 Temperature High
        2. 7.3.5.2 Temperature Low
        3. 7.3.5.3 Humidity High
        4. 7.3.5.4 Humidity Low
    4. 7.4 Device Functional Modes
      1. 7.4.1 Sleep Mode vs. Measurement Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Bus Address Configuration
      2. 7.5.2 I2C Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Read and Write Operations
    6. 7.6 Register Maps
      1. 7.6.1  Address 0x00 Temperature LSB
      2. 7.6.2  Address 0x01 Temperature MSB
      3. 7.6.3  Address 0x02 Humidity LSB
      4. 7.6.4  Address 0x03 Humidity MSB
      5. 7.6.5  Address 0x04 Interrupt DRDY
      6. 7.6.6  Address 0x05 Temperature MAX
      7. 7.6.7  Address 0x06 Humidity MAX
      8. 7.6.8  Address 0x07 Interrupt Configuration
      9. 7.6.9  Address 0x08 Temperature Offset Adjustment
      10. 7.6.10 47
      11. 7.6.11 Address 0x09 Humidity Offset Adjustment
      12. 7.6.12 49
      13. 7.6.13 Address 0x0A Temperature Threshold LOW
      14. 7.6.14 Address 0x0B Temperature Threshold HIGH
      15. 7.6.15 Address 0x0C Humidity Threshold LOW
      16. 7.6.16 Address 0x0D Humidity Threshold HIGH
      17. 7.6.17 Address 0x0E Reset and DRDY/INT Configuration Register
      18. 7.6.18 Address 0x0F Measurement Configuration
      19. 7.6.19 Manufacturer ID Low
      20. 7.6.20 Manufacturer ID High
      21. 7.6.21 Device ID Low
      22. 7.6.22 Device ID High
  9. 8  Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Guidelines for HDC2010 Storage and PCB Assembly
        1. 10.1.1.1 Storage and Handling
        2. 10.1.1.2 Soldering Reflow
        3. 10.1.1.3 Rework
        4. 10.1.1.4 High Temperature and Humidity Exposure
        5. 10.1.1.5 Bake/Re-Hydration Procedure
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YPA|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) HDC2010 UNIT
DSBGA (YPA)
6 PINS
RθJA Junction-to-ambient thermal resistance 114.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.8 °C/W
RθJB Junction-to-board thermal resistance 35.2 °C/W
ΨJT Junction-to-top characterization parameter 0.6 °C/W
ΨJB Junction-to-board characterization parameter 35.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.